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ORCIDChris Bailey 0001
Person information
- affiliation: University of Greenwich, London, UK
Other persons with the same name
- Chris Bailey — disambiguation page
- Christopher Bailey 0002
![[0000-0003-0634-320X]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0003-0634-320X")
(aka: Chris Bailey 0002, Chris Crispin-Bailey, Christopher Crispin-Bailey) — University of York, UK - Chris Bailey 0003 — Sheffield Hallam University, Department of Education, Childhood, and Inclusion, UK
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2020 – today
- 2024
[j30]Pushparajah Rajaguru, Tim Tilford, Chris Bailey, Stoyan Stoyanov:
Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module. IEEE Access 12: 25215-25227 (2024)- 2023
- [j29]Stoyan Stoyanov, Chris Bailey:
Modeling Insights Into the Assembly Challenges of Focal Plane Arrays. IEEE Access 11: 35207-35219 (2023) - 2020
- [j28]Mominul Ahsan, Stoyan Stoyanov, Chris Bailey, Alhussein Albarbar:
Developing Computational Intelligence for Smart Qualification Testing of Electronic Products. IEEE Access 8: 16922-16933 (2020)
2010 – 2019
- 2019
- [j27]Fateme Dinmohammadi, David Flynn, Chris Bailey, Michael G. Pecht, Chunyan Yin, Pushparajah Rajaguru, Valentin Robu:
Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications. IEEE Access 7: 54658-54669 (2019) - [j26]Ana Elsa Hinojosa Herrera, Stoyan Stoyanov, Chris Bailey, Chris Walshaw, Chunyan Yin:
Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Comput. Sci. 9(1): 200 (2019) - [j25]Stoyan Stoyanov, Mominul Ahsan, Chris Bailey, Tracy Wotherspoon, Craig Hunt:
Predictive analytics methodology for smart qualification testing of electronic components. J. Intell. Manuf. 30(3): 1497-1514 (2019) - 2018
- [j24]Jamie Blanche, David Flynn, Helen Lewis, Gary D. Couples, Jim Buckman, Chris Bailey, Tim Tilford:
Analysis of Sandstone Pore Space Fluid Saturation and Mineralogy Variation via Application of Monostatic K-Band Frequency Modulated Continuous Wave Radar. IEEE Access 6: 44376-44389 (2018) - [j23]Pushparajah Rajaguru, H. Lu, Chris Bailey, Alberto Castellazzi, V. Pathirana, N. Udugampola, Florin Udrea:
Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectron. Reliab. 83: 146-156 (2018) - [j22]Tim Tilford, Stoyan Stoyanov, Jessica B. S. Langbaum, Jan Christoph Janhsen, Matthias Burgard, Richard B. Buxton, Chris Bailey:
Design, manufacture and test for reliable 3D printed electronics packaging. Microelectron. Reliab. 85: 109-117 (2018) - [j21]Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey:
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. Microelectron. Reliab. 87: 1-14 (2018) - 2017
- [j20]Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise:
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectron. Reliab. 68: 77-85 (2017) - [j19]Jose Angel Ortiz Gonzalez, Olayiwola Alatise, Attahir Murtala Aliyu, Pushparajah Rajaguru, Alberto Castellazzi, Li Ran, Philip Mawby, Chris Bailey:
Evaluation of SiC Schottky Diodes Using Pressure Contacts. IEEE Trans. Ind. Electron. 64(10): 8213-8223 (2017) - 2016
- [j18]Stoyan Stoyanov, Chris Bailey, Georgios Tourloukis:
Similarity approach for reducing qualification tests of electronic components. Microelectron. Reliab. 67: 111-119 (2016) - 2015
- [j17]Chunyan Yin, Chris Best, Chris Bailey, Stoyan Stoyanov:
Statistical analysis of the impact of refinishing process on leaded components. Microelectron. Reliab. 55(2): 424-431 (2015) - [j16]Pushparajah Rajaguru, Hua Lu, Chris Bailey:
Sintered silver finite element modelling and reliability based design optimisation in power electronic module. Microelectron. Reliab. 55(6): 919-930 (2015) - [j15]Stoyan Stoyanov, Chris Bailey:
Modelling the impact of refinishing processes on COTS components for use in aerospace applications. Microelectron. Reliab. 55(9-10): 1271-1279 (2015) - [j14]Pushparajah Rajaguru, Hua Lu, Chris Bailey:
A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectron. Reliab. 55(11): 2371-2381 (2015) - 2014
- [j13]Mahera Musallam, Chunyan Yin, Chris Bailey, C. Mark Johnson:
Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules. Microelectron. Reliab. 54(1): 172-181 (2014) - [c1]Bozena Kaminska, Bernard Courtois, Chris Bailey:
New topic session 2B: Co-design and reliability of power electronic modules - Current status and future challenges. VTS 2014: 1 - 2013
- [j12]Stoyan Stoyanov, Chris Bailey, M. O. Alam, Chunyan Yin, Chris Best, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott:
Modelling methodology for thermal analysis of hot solder dip process. Microelectron. Reliab. 53(8): 1055-1067 (2013) - 2012
- [j11]Thamo Sutharssan, Stoyan Stoyanov, Chris Bailey, Yasmine Z. Rosunally:
Prognostics and Health Monitoring of High Power LED. Micromachines 3(1): 78-100 (2012) - 2011
- [j10]Xiangdong Xue, Chris Bailey, Hua Lu, Stoyan Stoyanov:
Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectron. Reliab. 51(5): 936-945 (2011) - [j9]Yasmine Z. Rosunally, Stoyan Stoyanov, Chris Bailey, Peter Mason, Sheelagh Campbell, George Monger, Ian Bell:
Fusion Approach for Prognostics Framework of Heritage Structure. IEEE Trans. Reliab. 60(1): 3-13 (2011) - 2010
- [j8]E. Kamara, Hua Lu, Chris Bailey, Chris Hunt, Davide Di Maio, Owen Thomas:
A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectron. Reliab. 50(9-11): 1706-1710 (2010)
2000 – 2009
- 2009
- [j7]Hua Lu, Chris Bailey, Chunyan Yin:
Design for reliability of power electronics modules. Microelectron. Reliab. 49(9-11): 1250-1255 (2009) - 2008
- [j6]M. J. Rizvi, Chris Bailey, Hua Lu:
Failure mechanisms of ACF joints under isothermal ageing. Microelectron. J. 39(9): 1101-1107 (2008) - [i1]Keith I. Sinclair, Tim Tilford, Marc P. Y. Desmulliez, George Goussetis, Chris Bailey, Kevin Parrott, Alan J. Sangster:
Open Ended Microwave Oven for Packaging. CoRR abs/0805.0943 (2008) - 2007
- [j5]Stoyan Stoyanov, Robert W. Kay, Chris Bailey, Marc P. Y. Desmulliez:
Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives. Microelectron. Reliab. 47(1): 132-141 (2007) - 2006
- [j4]Stephen Ridout, Milos Dusek, Chris Bailey, Chris Hunt:
Assessing the performance of crack detection tests for solder joints. Microelectron. Reliab. 46(12): 2122-2130 (2006) - 2005
- [j3]M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu:
Study of anisotropic conductive adhesive joint behavior under 3-point bending. Microelectron. Reliab. 45(3-4): 589-596 (2005) - 2003
- [j2]Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey, Hua Lu:
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectron. Reliab. 43(4): 625-633 (2003) - 2002
- [j1]Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan:
No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectron. Reliab. 42(8): 1205-1212 (2002)
Coauthor Index
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last updated on 2024-10-07 22:24 CEST by the dblp team
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