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Y. C. Chan
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2010 – 2019
- 2016
- [j29]M. Sobczak-Edmans, T. H. B. Ng, Y. C. Chan, E. Chew, Kai-Hsiang Chuang, Shen-Hsing Annabel Chen:
Temporal dynamics of visual working memory. NeuroImage 124: 1021-1030 (2016) - 2014
- [j28]Johanna Virkki, Toni Björninen, T. Kellomäki, Sari Merilampi, I. Shafiq, Leena Ukkonen, Lauri Sydänheimo, Y. C. Chan:
Reliability of washable wearable screen printed UHF RFID tags. Microelectron. Reliab. 54(4): 840-846 (2014) - [j27]Asit Kumar Gain, Y. C. Chan:
Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solders. Microelectron. Reliab. 54(5): 945-955 (2014) - 2012
- [c4]Zahid Ullah, Manish Kumar Jaiswal, Y. C. Chan, Ray C. C. Cheung:
FPGA Implementation of SRAM-based Ternary Content Addressable Memory. IPDPS Workshops 2012: 383-389 - 2011
- [j26]Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung:
Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates. Microelectron. Reliab. 51(5): 975-984 (2011) - [j25]Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung:
Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads. Microelectron. Reliab. 51(12): 2306-2313 (2011) - 2010
- [j24]Mansur Ahmed, Tama Fouzder, Ahmed Sharif, Asit Kumar Gain, Y. C. Chan:
Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy. Microelectron. Reliab. 50(8): 1134-1141 (2010) - [j23]Tama Fouzder, Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung:
Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads. Microelectron. Reliab. 50(12): 2051-2058 (2010) - [j22]Y. C. Chan, W. A. Johnson, S. K. Karuza, A. M. Young, J. C. Camparo:
Self-Monitoring and Self-Assessing Atomic Clocks. IEEE Trans. Instrum. Meas. 59(2): 330-334 (2010)
2000 – 2009
- 2009
- [j21]Jun Shen, Y. C. Chan:
Research advances in nano-composite solders. Microelectron. Reliab. 49(3): 223-234 (2009) - [j20]Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung:
Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages. Microelectron. Reliab. 49(7): 746-753 (2009) - 2008
- [j19]R. Smit, A. L. Brown, Y. C. Chan:
Do air pollution emissions and fuel consumption models for roadways include the effects of congestion in the roadway traffic flow? Environ. Model. Softw. 23(10-11): 1262-1270 (2008) - [c3]Sachin Kumar, Myra Torres, Y. C. Chan, Michael G. Pecht:
A hybrid prognostics methodology for electronic products. IJCNN 2008: 3479-3485 - 2006
- [j18]Rashed Adnan Islam, Y. C. Chan, W. Jillek, Samia Islam:
Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders. Microelectron. J. 37(8): 705-713 (2006) - [c2]C.-Y. Ho, Y.-C. Chan, Y.-C. Chen:
An Efficient Mechanism of TCP-Vegas on Mobile IP Networks. INFOCOM 2006 - 2005
- [j17]M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu:
Study of anisotropic conductive adhesive joint behavior under 3-point bending. Microelectron. Reliab. 45(3-4): 589-596 (2005) - 2004
- [j16]S. C. Tan, Y. C. Chan, Y. W. Chiu, C. W. Tan:
Thermal stability performance of anisotropic conductive film at different bonding temperatures. Microelectron. Reliab. 44(3): 495-503 (2004) - [j15]N. H. Yeung, Victor Lau, Y. C. Chan:
Bias-HAST on tape ball grid array (TBGA) test pattern. Microelectron. Reliab. 44(4): 595-602 (2004) - [j14]Rashed Adnan Islam, Y. C. Chan:
Effect of microwave preheating on the bonding performance of flip chip on flex joint. Microelectron. Reliab. 44(5): 815-821 (2004) - [j13]C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So:
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. Microelectron. Reliab. 44(5): 823-831 (2004) - 2003
- [j12]C. W. Tan, Y. C. Chan, N. H. Yeung:
Effect of autoclave test on anisotropic conductive joints. Microelectron. Reliab. 43(2): 279-285 (2003) - [j11]C. W. Tan, Y. C. Chan, N. H. Yeung:
Behaviour of anisotropic conductive joints under mechanical loading. Microelectron. Reliab. 43(3): 481-486 (2003) - 2002
- [j10]C. F. Luk, Y. C. Chan, K. C. Hung:
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. Microelectron. Reliab. 42(3): 381-389 (2002) - [j9]C. F. Luk, Y. C. Chan, K. C. Hung:
Application of adhesive bonding techniques in hard disk drive head assembly. Microelectron. Reliab. 42(4-5): 767-777 (2002) - [j8]S. H. Fan, Y. C. Chan:
Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications. Microelectron. Reliab. 42(7): 1081-1090 (2002) - [j7]Y. C. Chan, D. Y. Luk:
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature. Microelectron. Reliab. 42(8): 1185-1194 (2002) - [j6]Y. C. Chan, D. Y. Luk:
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure. Microelectron. Reliab. 42(8): 1195-1204 (2002) - [j5]Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan:
No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectron. Reliab. 42(8): 1205-1212 (2002) - [j4]Y. W. Chiu, Y. C. Chan, S. M. Lui:
Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects. Microelectron. Reliab. 42(12): 1945-1951 (2002) - 2001
- [j3]P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai:
Study of micro-BGA solder joint reliability. Microelectron. Reliab. 41(2): 287-293 (2001) - [j2]Y. C. Chan, P. L. Tu, K. C. Hung:
Study of the self-alignment of no-flow underfill for micro-BGA assembly. Microelectron. Reliab. 41(11): 1867-1875 (2001) - [j1]P. L. Tu, Y. C. Chan, K. C. Hung:
Reliability of microBGA assembly using no-flow underfill. Microelectron. Reliab. 41(12): 1993-2000 (2001)
1980 – 1989
- 1985
- [c1]Y. C. Chan:
FORTLOG = Fortran + Logique. SPLT 1985
Coauthor Index
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