"Study of anisotropic conductive adhesive joint behavior under 3-point bending."

M. J. Rizvi et al. (2005)

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DOI: 10.1016/J.MICROREL.2004.10.015

access: closed

type: Journal Article

metadata version: 2024-08-04

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M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu:
Study of anisotropic conductive adhesive joint behavior under 3-point bending. Microelectron. Reliab. 45(3-4): 589-596 (2005)

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