"No-flow underfill flip chip assembly--an experimental and modeling analysis."

Hua Lu et al. (2002)

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DOI: 10.1016/S0026-2714(02)00092-6

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type: Journal Article

metadata version: 2020-02-22

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Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan:
No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectron. Reliab. 42(8): 1205-1212 (2002)

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