"Design, manufacture and test for reliable 3D printed electronics packaging."

Tim Tilford et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.04.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tim Tilford, Stoyan Stoyanov, Jessica B. S. Langbaum, Jan Christoph Janhsen, Matthias Burgard, Richard B. Buxton, Chris Bailey:
Design, manufacture and test for reliable 3D printed electronics packaging. Microelectron. Reliab. 85: 109-117 (2018)

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