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ORCIDY. J. Su
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Journal Articles
- 2005
[j6]C. F. Tsang, C. K. Chang, A. Krishnamoorthy, K. Y. Ee, Y. J. Su, H. Y. Li, W. H. Li, L. Y. Wong:
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections. Microelectron. Reliab. 45(3-4): 517-525 (2005)- [j5]H. Y. Li, Y. J. Su, C. F. Tsang, S. M. Sohan, V. N. Bliznetsov, L. Zhang:
Process improvement of 0.13mum Cu/Low K (Black DiamondTM) dual damascene interconnection. Microelectron. Reliab. 45(7-8): 1134-1143 (2005) - 2004
- [j4]C. F. Tsang, C. Y. Li, A. Krishnamoorthy, Y. J. Su, H. Y. Li, L. Y. Wong, W. H. Li, L. J. Tang, K. Y. Ee:
Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. Microelectron. J. 35(9): 693-700 (2004) - 2003
- [j3]Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo:
Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectron. J. 34(2): 109-113 (2003) - [j2]C. F. Tsang, V. N. Bliznetsov, Y. J. Su:
Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process. Microelectron. J. 34(11): 1051-1058 (2003) - [j1]Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo:
Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectron. Reliab. 43(8): 1311-1316 (2003)
Conference and Workshop Papers
- 2010
- [c2]Kuo-Tai Fan, Yu-Chang Tzeng, Y. F. Lin, Y. J. Su, Kun-Shan Chen:
Tree identification using a distributed K-mean clustering algorithm. IGARSS 2010: 3446-3449 - 2009
- [c1]Yu-Chang Tzeng, Kuo-Tai Fan, Y. J. Su, Kun-Shan Chen:
A Parallel Differential Box Counting Algorithm Applied to Hyperspectral Image Classifications. IGARSS (5) 2009: 216-219
Coauthor Index
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