"Process improvement of 0.13mum Cu/Low K (Black DiamondTM) dual ..."

H. Y. Li et al. (2005)

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DOI: 10.1016/J.MICROREL.2004.11.057

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type: Journal Article

metadata version: 2020-02-22

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H. Y. Li, Y. J. Su, C. F. Tsang, S. M. Sohan, V. N. Bliznetsov, L. Zhang:
Process improvement of 0.13mum Cu/Low K (Black Diamond^TM) dual damascene interconnection. Microelectron. Reliab. 45(7-8): 1134-1143 (2005)

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