"Investigation of defect on copper bond pad surface in copper/low k process ..."

Y. S. Zheng et al. (2003)

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DOI: 10.1016/S0026-2714(03)00134-3

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type: Journal Article

metadata version: 2020-02-22

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Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo:
Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectron. Reliab. 43(8): 1311-1316 (2003)

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