"Polymer residue chemical composition analysis and its effect on via ..."

Y. S. Zheng et al. (2003)

> Home

Details and statistics

DOI: 10.1016/S0026-2692(02)00154-4

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mj/ZhengGSF03
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mj/ZhengGSF03
Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo:
Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectron. J. 34(2): 109-113 (2003)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.