"A study of post-etch wet clean on electrical and reliability performance ..."

C. F. Tsang et al. (2005)

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DOI: 10.1016/J.MICROREL.2004.07.007

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type: Journal Article

metadata version: 2020-02-22

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C. F. Tsang, C. K. Chang, A. Krishnamoorthy, K. Y. Ee, Y. J. Su, H. Y. Li, W. H. Li, L. Y. Wong:
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections. Microelectron. Reliab. 45(3-4): 517-525 (2005)

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