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Journal Articles
- 2016
[j16]K.-C. Wu, Kuo-Ning Chiang
:
Characterization on acceleration-factor equation for packaging-solder joint reliability. Microelectron. Reliab. 65: 167-172 (2016)- 2012
- [j15]Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung, Chang-Chun Lee, Kuo-Ning Chiang:
Light degradation test and design of thermal performance for high-power light-emitting diodes. Microelectron. Reliab. 52(5): 794-803 (2012) - 2011
- [j14]Tsung-Lin Chou, Shin-Yueh Yang, Chung-Jung Wu, Cheng-Nan Han, Kuo-Ning Chiang:
Measurement and simulation of interfacial adhesion strength between SiO2 thin film and III-V material. Microelectron. Reliab. 51(9-11): 1757-1761 (2011) - [j13]T. Y. Hung, S. Y. Chiang, C. J. Huang, Chang-Chun Lee, Kuo-Ning Chiang:
Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test. Microelectron. Reliab. 51(9-11): 1819-1823 (2011) - 2009
- [j12]Tsung-Lin Chou, Chien-Fu Huang, Cheng-Nan Han, Shin-Yueh Yang, Kuo-Ning Chiang:
Fabrication process simulation and reliability improvement of high-brightness LEDs. Microelectron. Reliab. 49(9-11): 1244-1249 (2009) - 2008
- [j11]Hsiao-Tung Ku, Kuo-Ning Chiang:
The mechanical stress resistance capability of stress buffer structures in analog devices. Microelectron. Reliab. 48(5): 716-723 (2008) - [j10]Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Ming-Chih Yew, Wen-Kun Yang, Kuo-Ning Chiang:
Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact. Microelectron. Reliab. 48(8-9): 1149-1154 (2008) - 2007
- [j9]Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang:
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology. Microelectron. Reliab. 47(2-3): 196-204 (2007) - [j8]C. C. Chiu, H. H. Chang, Chang-Chun Lee, C. C. Hsia, Kuo-Ning Chiang:
Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure. Microelectron. Reliab. 47(9-11): 1506-1511 (2007) - [j7]Ming-Chih Yew, Chan-Yen Chou, Kuo-Ning Chiang:
Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis. Microelectron. Reliab. 47(9-11): 1658-1662 (2007) - 2006
- [j6]Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang:
Thermal resistance analysis and validation of flip chip PBGA packages. Microelectron. Reliab. 46(2-4): 440-448 (2006) - [j5]Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang:
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. Microelectron. Reliab. 46(2-4): 523-534 (2006) - [j4]Ming-Chih Yew, C. Y. Chou, C. S. Huang, W. K. Yang, Kuo-Ning Chiang:
The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis. Microelectron. Reliab. 46(9-11): 1874-1879 (2006) - [j3]Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang:
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. Microelectron. Reliab. 46(12): 2104-2111 (2006) - 2004
- [j2]Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang:
Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. Microelectron. Reliab. 44(4): 627-638 (2004) - 2003
- [j1]Kuo-Ming Chen, Kuo-Ning Chiang:
Impact of probing procedure on flip chip reliability. Microelectron. Reliab. 43(1): 123-130 (2003)
Coauthor Index
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