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2020 – today
- 2023
[c2]Y. H. Lin, Chang-Chun Lee
, C. Y. Liao, M. H. Lin, W. C. Tu, Robin Chen, H. P. Chen, Winston S. Shue, Min Cao:
A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects. IRPS 2023: 1-4- [c1]Chi-Wei Wang, Che-Pei Chang, Chang-Chun Lee:
Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation. IRPS 2023: 1-4 - 2022
- [i1]Cheng Zhan, Licheng Zhang, Xin Zhao, Chang-Chun Lee, Shujiao Huang:
Neural Architecture Search for Inversion. CoRR abs/2201.01772 (2022)
2010 – 2019
- 2018
- [j8]Chang-Chun Lee, Chuan-Hsi Liu, Dian-Yong Li, Chia-Ping Hsieh:
Effect of contact-etch-stop-layer and Si1-xGex channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays. Microelectron. Reliab. 83: 230-234 (2018) - 2015
- [j7]Chang-Chun Lee, Chien-Chao Huang:
Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology. Microelectron. Reliab. 55(11): 2213-2219 (2015) - [j6]Tao-Chih Chang, Chang-Chun Lee, Chia-Ping Hsieh, Sheng-Che Hung, Ren-Shin Cheng:
Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology. Microelectron. Reliab. 55(12): 2582-2588 (2015) - 2012
- [j5]Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung, Chang-Chun Lee, Kuo-Ning Chiang:
Light degradation test and design of thermal performance for high-power light-emitting diodes. Microelectron. Reliab. 52(5): 794-803 (2012) - 2011
- [j4]T. Y. Hung, S. Y. Chiang, C. J. Huang, Chang-Chun Lee, Kuo-Ning Chiang:
Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test. Microelectron. Reliab. 51(9-11): 1819-1823 (2011)
2000 – 2009
- 2007
- [j3]Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang:
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology. Microelectron. Reliab. 47(2-3): 196-204 (2007) - [j2]C. C. Chiu, H. H. Chang, Chang-Chun Lee, C. C. Hsia, Kuo-Ning Chiang:
Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure. Microelectron. Reliab. 47(9-11): 1506-1511 (2007) - 2006
- [j1]Robin C. J. Wang, Chang-Chun Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao:
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect. Microelectron. Reliab. 46(9-11): 1673-1678 (2006)
Coauthor Index
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