"A study of Cu/Low-k stress-induced voiding at via bottom and its ..."

Robin C. J. Wang et al. (2006)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2006.07.053

access: closed

type: Journal Article

metadata version: 2024-11-04

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/WangLCWC06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/WangLCWC06
Robin C. J. Wang, Chang-Chun Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao:
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect. Microelectron. Reliab. 46(9-11): 1673-1678 (2006)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.