"Experimental characterization and mechanical behavior analysis of ..."

Chih-Tang Peng et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.06.010

access: closed

type: Journal Article

metadata version: 2022-10-02

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Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang:
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. Microelectron. Reliab. 46(2-4): 523-534 (2006)

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