"Thermal resistance analysis and validation of flip chip PBGA packages."

Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang (2006)

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DOI: 10.1016/J.MICROREL.2005.06.001

access: closed

type: Journal Article

metadata version: 2022-10-02

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Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang:
Thermal resistance analysis and validation of flip chip PBGA packages. Microelectron. Reliab. 46(2-4): 440-448 (2006)

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