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Kuo-Ming Chen
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2010 – 2019
- 2019
- [j7]Kuo-Ming Chen, Tsung-Hui Chang, Kai-Cheng Wang, Ta-Sung Lee:
Machine Learning Based Automatic Diagnosis in Mobile Communication Networks. IEEE Trans. Veh. Technol. 68(10): 10081-10093 (2019) - [c4]Kuo-Ming Chen, Tsung-Hui Chang, Ta-Sung Lee:
Lifetime Maximization for Uplink Transmission in UAV-Enabled Wireless Networks. WCNC 2019: 1-6 - 2018
- [c3]Kuo-Ming Chen, Yun-Han Pan, Ta-Sung Lee:
Low-Complexity Beam Selection for Hybrid Precoded Multi-User mmWave Communications. ICSPCC 2018: 1-5 - 2015
- [i1]Chun-Wei Li, Kuo-Ming Chen, Po-Chun Fu, Wei-Ning Chen, Che Lin:
Energy-Efficient Deterministic Adaptive Beamforming Algorithms for Distributed Sensor/Relay Networks. CoRR abs/1509.02663 (2015) - 2011
- [j6]Hsien-Chie Cheng, Kun-Yu Hsieh, Kuo-Ming Chen:
Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology. Microelectron. Reliab. 51(4): 826-836 (2011)
2000 – 2009
- 2007
- [j5]Lih-Chyau Wuu, Tzong-Jye Liu, Kuo-Ming Chen:
A longest prefix first search tree for IP lookup. Comput. Networks 51(12): 3354-3367 (2007) - [j4]Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu:
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectron. Reliab. 47(8): 1273-1279 (2007) - 2006
- [j3]Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang:
Thermal resistance analysis and validation of flip chip PBGA packages. Microelectron. Reliab. 46(2-4): 440-448 (2006) - [j2]Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang:
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration. Microelectron. Reliab. 46(12): 2104-2111 (2006) - 2005
- [c2]Lih-Chyau Wuu, Kuo-Ming Chen, Tzong-Jye Liu:
A longest prefix first search tree for IP lookup. ICC 2005: 989-993 - 2004
- [c1]Kuo-Ming Chen, Yuan-Tsung Chen, Ming-Shi Wang:
Reconstruction and Fusion of Multi-modality Spinal Images. CISST 2004: 151-157 - 2003
- [j1]Kuo-Ming Chen, Kuo-Ning Chiang:
Impact of probing procedure on flip chip reliability. Microelectron. Reliab. 43(1): 123-130 (2003)
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