"Thermal-mechanical optimization of a novel nanocomposite-film typed flip ..."

Hsien-Chie Cheng, Kun-Yu Hsieh, Kuo-Ming Chen (2011)

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DOI: 10.1016/J.MICROREL.2010.11.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hsien-Chie Cheng, Kun-Yu Hsieh, Kuo-Ming Chen:
Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology. Microelectron. Reliab. 51(4): 826-836 (2011)

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