"Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite ..."

Yi-Shao Lai et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.09.023

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu:
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectron. Reliab. 47(8): 1273-1279 (2007)

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