"The solder on rubber (SOR) interconnection design and its reliability ..."

Ming-Chih Yew et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.07.084

access: closed

type: Journal Article

metadata version: 2022-11-23

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Ming-Chih Yew, C. Y. Chou, C. S. Huang, W. K. Yang, Kuo-Ning Chiang:
The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis. Microelectron. Reliab. 46(9-11): 1874-1879 (2006)

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