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Bongtae Han

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2020 – today

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2022
[j12]
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  - journals/tie/PrisacaruGHZ22
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  - https://dblp.org/rec/journals/tie/PrisacaruGHZ22
Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Guo Qi Zhang:
Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach. IEEE Trans. Ind. Electron. 69(3): 2996-3006 (2022)

2010 – 2019

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2017
[j11]
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  - journals/mr/PalczynskaPGHMM17
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  - https://dblp.org/rec/journals/mr/PalczynskaPGHMM17
Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Jakub Gromala, Bongtae Han, Dirk Mayer, Tobias Melz:
Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor. Microelectron. Reliab. 74: 165-172 (2017)
[j10]
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  - journals/mr/WeiHYSKM17
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Hsiu-Ping Wei, Bongtae Han, Byeng Dong Youn, Hyuk Shin, Ilho Kim, Hojeong Moon:
Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method. Microelectron. Reliab. 78: 319-330 (2017)
2016
[j9]
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Alicja Palczynska, Przemyslaw Jakub Gromala, Dirk Mayer, Bongtae Han, Tobias Melz:
In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor. Microelectron. Reliab. 62: 58-62 (2016)
[j8]
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  - journals/mr/MahanKWHKMH16
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Kenny Mahan, Byung Kim, Bulong Wu, Bongtae Han, Ilho Kim, Hojeong Moon, Young Nam Hwang:
Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages. Microelectron. Reliab. 63: 134-141 (2016)
2014
[j7]
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  - journals/mr/KimHK14
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Dae-Suk Kim, Bongtae Han, Youn-Jea Kim:
Degradation analysis of secondary lens system and its effect on performance of LED-based luminaire. Microelectron. Reliab. 54(1): 131-137 (2014)
2013
[j6]
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  - journals/mr/SongHL13
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Bong-Min Song, Bongtae Han, Joon-Hyun Lee:
Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability. Microelectron. Reliab. 53(3): 435-442 (2013)
2012
[j5]
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  - journals/mr/SongHBASW12
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Bong-Min Song, Bongtae Han, Avram Bar-Cohen, Mehmet Arik, Rajdeep Sharma, Stan Weaver:
Life prediction of LED-based recess downlight cooled by synthetic jet. Microelectron. Reliab. 52(5): 937-948 (2012)
[j4]
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  - journals/sensors/Han12a
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Bongtae Han:
Measurements of True Leak Rates of MEMS Packages. Sensors 12(3): 3082-3104 (2012)
2010
[j3]
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  - journals/mr/JangYWHH10
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Changsoo Jang, Byeng Dong Youn, Ping F. Wang, Bongtae Han, Suk-Jin Ham:
Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages. Microelectron. Reliab. 50(4): 507-513 (2010)

2000 – 2009

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2008
[j2]
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  - journals/mr/GoswamiH08
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Arindam Goswami, Bongtae Han:
On the applicability of MIL-Spec-based helium fine leak test to packages with sub-micro liter cavity volumes. Microelectron. Reliab. 48(11-12): 1815-1821 (2008)
2005
[j1]
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  - journals/mr/JooCH05
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Jinwon Joo, Seungmin Cho, Bongtae Han:
Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry. Microelectron. Reliab. 45(3-4): 637-646 (2005)

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