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Avram Bar-Cohen

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2010 – 2019

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2016
[j5]
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  - journals/tvlsi/SerafyBSY16
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  - https://dblp.org/rec/journals/tvlsi/SerafyBSY16
Caleb Serafy, Avram Bar-Cohen, Ankur Srivastava, Donald Yeung:
Unlocking the True Potential of 3-D CPUs With Microfluidic Cooling. IEEE Trans. Very Large Scale Integr. Syst. 24(4): 1515-1523 (2016)
2013
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Bing Shi, Ankur Srivastava, Avram Bar-Cohen:
Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit. IET Circuits Devices Syst. 7(5): 223-231 (2013)
2012
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  - journals/mr/SongHBASW12
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Bong-Min Song, Bongtae Han, Avram Bar-Cohen, Mehmet Arik, Rajdeep Sharma, Stan Weaver:
Life prediction of LED-based recess downlight cooled by synthetic jet. Microelectron. Reliab. 52(5): 937-948 (2012)
[c1]
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Bing Shi, Ankur Srivastava, Avram Bar-Cohen:
Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs. ISVLSI 2012: 33-38

2000 – 2009

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2006
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Avram Bar-Cohen, Mehmet Arik, M. Ohadi:
Direct Liquid Cooling of High Flux Micro and Nano Electronic Components. Proc. IEEE 94(8): 1549-1570 (2006)

1980 – 1989

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1985
[j1]
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Avram Bar-Cohen:
Bounding relations for natural convection heat transfer from vertical printed circuit boards. Proc. IEEE 73(9): 1388-1395 (1985)

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