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ORCIDBernd Deutschmann
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2020 – today
- 2024
[j23]Semih Ramazanoglu
, Alicja Michalowska-Forsyth, Bernd Deutschmann:
Bias dependence in statistical random telegraph noise analysis based on nanoscale CMOS ring oscillators. Elektrotech. Informationstechnik 141(1): 37-46 (2024)- [j22]Daniel Kircher, Simon Profanter, Bernd Deutschmann:
A modular and scalable system for electromagnetic compatibility testing of integrated circuits. Elektrotech. Informationstechnik 141(1): 47-55 (2024) - [j21]Nikolaus Czepl, Nikolaus Juch, Bernd Deutschmann:
Electromagnetic emission of integrated circuits induced by ionizing radiation and its measurement uncertainties. Elektrotech. Informationstechnik 141(1): 56-65 (2024) - [j20]Bernd Deutschmann, Nikolaus Juch:
Influence of the IC power supply and decoupling capacitor arrangement on the electromagnetic emission. Elektrotech. Informationstechnik 141(1): 66-75 (2024) - 2023
- [j19]Jan Hansen, Bernd Deutschmann:
Efficient electromagnetic interference modeling of a gallium nitride half bridge. Elektrotech. Informationstechnik 140(1): 95-102 (2023) - [c20]Harald Dillersberger, Douglas Tham, Bernd Deutschmann:
A Sub-100 mV AC/DC Converter with Impedance Matching for Magnetic Field Energy Harvesting. PRIME 2023: 357-360 - [c19]Dominik Zupan, Daniel Kircher, Nikolaus Czepl, Bernd Deutschmann:
Framework to Simulate and Analyse the Electromagnetic Emission of Integrated Circuits under Electromagnetic Interference. SMACD 2023: 1-4 - 2021
- [j18]Bernd Deutschmann:
Leistungselektronik/Leistungshalbleiter - Anwendungen von Milliwatt bis Megawatt, vom Mikrochip bis zum System. Elektrotech. Informationstechnik 138(1): 1-2 (2021) - [j17]Michael Fuchs, Lukas Spielberger, Ko Odreitz, Bernd Deutschmann:
Fast and simple model generation for superjunction power MOSFETs. Elektrotech. Informationstechnik 138(1): 48-52 (2021) - 2020
- [j16]Dominik Zupan, Bernd Deutschmann:
Comparison of EMI effects on different current mirror structures using a post-processing framework. Elektrotech. Informationstechnik 137(2): 93-99 (2020) - [j15]Volha Subotskaya, Emanuele Bodano, Bernd Deutschmann:
EMI-optimized driver for high-frequency boost converter. Elektrotech. Informationstechnik 137(2): 100-106 (2020) - [j14]Andrea Minetto, Bernd Deutschmann, Oliver Häberlen, Gilberto Curatola:
System-level evaluation of dynamic effects in a GaN-based class-E power amplifier. Integr. 75: 11-18 (2020)
2010 – 2019
- 2019
- [j13]Alicja Michalowska-Forsyth, Patrick Schrey, Bernd Deutschmann:
Erratum to: Design and theoretical comparison of input ESD devices in 180 nm CMOS with focus on low capacitance. Elektrotech. Informationstechnik 136(2): 224 (2019) - [c18]Martin Ibel, Herbert Hackl, Bernhard Auinger, Christian Stockreiter, Bernd Deutschmann:
Survey on the Generation of Equivalent Circuit Cable Models for Transient Simulation. MIPRO 2019: 102-107 - [c17]Rahul Nadgouda, Bernd Deutschmann:
Band Specific Suppression of Harmonics and its Effects on Power Efficiency. PRIME 2019: 169-172 - [c16]Andrea Minetto, Bernd Deutschmann, Oliver Häberlen, Gilberto Curatola:
System-Level Assessment of Dynamic Effects in GaN-based Power Converters. PRIME 2019: 281-284 - [c15]Dominik Zupan, Bernd Deutschmann:
Identification of EMI Induced Changes During the Design of ICs using a Post-Processing Framework. SMACD 2019: 201-204 - 2018
- [j12]Bernd Deutschmann:
Mikroelektronik aus Österreich - Grundlage für Österreichs Innovations- und Wettbewerbsfähigkeit. Elektrotech. Informationstechnik 135(1): 1-2 (2018) - [j11]Volha Subotskaya, Vratislav Mihal, Mikhail Tulupov, Bernd Deutschmann:
Optimized gate driver for high-frequency buck converter. Elektrotech. Informationstechnik 135(1): 40-47 (2018) - [j10]Alicja Malgorzata Michalowska-Forsyth, Patrick Schrey, Bernd Deutschmann:
Design and theoretical comparison of input ESD devices in 180 nm CMOS with focus on low capacitance. Elektrotech. Informationstechnik 135(1): 69-75 (2018) - [j9]Carolin Kollegger, Philipp Greiner, Inge Siegl, Christoph Steffan, Martin Wiessflecker, Bruna Pekec, Martin Hajnsek, Frank Sinner, Gerald Holweg, Bernd Deutschmann:
Intelligent NFC potassium measurement strip with hemolysis check in capillary blood. Elektrotech. Informationstechnik 135(1): 83-88 (2018) - [j8]Bernd Deutschmann, Gunter Winkler, Paul Kastner:
Impact of electromagnetic interference on the functional safety of smart power devices for automotive applications. Elektrotech. Informationstechnik 135(4-5): 352-359 (2018) - [j7]Herwig Renner, Uwe Schichler, Klaus Krischan, Bernd Deutschmann, Bernhard Auinger, Martin Horn, Markus Reichhartinger, Franz Vollmaier:
Innovativer HVDC-DC-Wandler für Hochspannungs-Gleichstrom-Netze - Grundsätzliche Überlegungen zu Topologie, Regelung und elektromagnetischer Verträglichkeit. Elektrotech. Informationstechnik 135(8): 497-506 (2018) - [c14]Carolin Kollegger, Christoph Steffan, Philipp Greiner, Clemens Rabl, David Lugitsch, Gerald Holweg, Bernd Deutschmann:
A Temperature Analysis for NFC-Powered Smart Lab-on-Chip Devices. MWSCAS 2018: 1058-1061 - 2017
- [c13]Carolin Kollegger, Philipp Greiner, Christoph Steffan, Martin Wiessflecker, Heiko Froehlich, Thoralf Kautzsch, Gerald Holweg, Bernd Deutschmann:
A system-on-chip NFC bicycle tire pressure measurement system. MWSCAS 2017: 60-63 - [c12]Christoph Steffan, Philipp Greiner, Carolin Kollegger, Inge Siegl, Gerald Holweg, Bernd Deutschmann:
Autonomous maximum power point tracking algorithm for ultra-low power energy harvesting. MWSCAS 2017: 1372-1375 - 2016
- [j6]Bernd Deutschmann:
Elektromagnetische Verträglichkeit und Robustheit elektronischer Systeme als Herausforderung des Technologiezeitalters. Elektrotech. Informationstechnik 133(1): 1-2 (2016) - [j5]Bernd Deutschmann, Stephan Pack, Gunter Winkler:
Von der Blitzentladung bis zu ESD-Testverfahren - Beanspruchungen von Geräten und integrierten Schaltungen sowie normative Anforderungen. Elektrotech. Informationstechnik 133(1): 3-10 (2016) - [j4]Bernd Deutschmann, Sandra Schindlbacher, Gunter Winkler:
Highlighting the distribution path of transient disturbances by near field scanning techniques. Elektrotech. Informationstechnik 133(1): 18-24 (2016) - [j3]Carolin Kollegger, Christoph Steffan, Philipp Greiner, Martin Wiessflecker, Gerald Holweg, Bernd Deutschmann:
Intelligent plaster for accurate body temperature monitoring and investigations regarding EMI using near-field magnetic scan. Elektrotech. Informationstechnik 133(1): 25-31 (2016) - 2015
- [c11]Bernd Deutschmann, Gunter Winkler, Timuçin Karaca:
Emission reduction in Class D audio amplifiers by optimizing spread spectrum modulation. EMC Compo 2015: 1-6 - [c10]Andrea Lavarda, Bernd Deutschmann:
EMI improved chopped operational amplifier. EMC Compo 2015: 72-76 - [c9]Andrea Lavarda, Dominik Amschl, Susanne Bauer, Bernd Deutschmann:
Characterization of the immunity of integrated circuits (ICs) at wafer level. EMC Compo 2015: 196-201 - [c8]Herbert Hackl, Gunter Winkler, Bernd Deutschmann:
Simulation of radiated emission during the design phase based on scattering parameter measurement. EMC Compo 2015: 228-231 - [c7]Christoph Steffan, Philipp Greiner, Bernd Deutschmann, Carolin Kollegger, Gerald Holweg:
Energy harvesting with on-chip solar cells and integrated DC/DC converter. ESSDERC 2015: 142-145 - 2013
- [c6]Bernd Deutschmann:
Spread spectrum clocking for emission reduction of charge pump applications. EMC Compo 2013: 123-128
2000 – 2009
- 2006
- [j2]Kurt Lamedschwandner, Bernd Deutschmann, Gunter Winkler, Timm Ostermann:
Vergleichende EMV-Untersuchungen auf Geräte- und IC-Ebene. Elektrotech. Informationstechnik 123(1-2): 9-14 (2006) - [j1]Bernd Deutschmann:
ICs als Quelle der Störemissionen von elektronischen Geräten und Systemen? Elektrotech. Informationstechnik 123(1-2): 15-21 (2006) - [c5]Kurt Lamedschwandner, Hans Preineder, Gunter Winkler, Bernd Deutschmann, Timm Ostermann:
EMV elektronischer Unterbaugruppen und integrierter Schaltkreise im Kraftfahrzeug. EMV 2006: 373-380 - 2003
- [c4]Bernd Deutschmann, Timm Ostermann:
CMOS output drivers with reduced ground bounce and electromagnetic emission. ESSCIRC 2003: 537-540 - [c3]Timm Ostermann, Bernd Deutschmann:
Characterization of the EME of integrated circuits with the help of the IEC standard 61967 [electromagnetic emission]. ETW 2003: 132-137 - [c2]Timm Ostermann, Bernd Deutschmann:
TEM-cell and surface scan to identify the electromagnetic emission of integrated circuits. ACM Great Lakes Symposium on VLSI 2003: 76-79 - [c1]Timm Ostermann, Wolfgang Gut, Christian Bacher, Bernd Deutschmann:
Measures to Reduce the Electromagnetic Emission of a SoC. VLSI-SOC 2003: 31-
Coauthor Index
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