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ORCIDAmadine Jouve
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2010 – 2019
- 2019
[c10]Emilie Bourjot, Paul Stewart, Christophe Dubarry
, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy:
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. 3DIC 2019: 1-5- [c9]Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger:
Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. 3DIC 2019: 1-7 - 2018
- [c8]Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux:
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS 2018: 4 - 2016
- [c7]Séverine Cheramy, Amandine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet:
Towards high density 3D interconnections. 3DIC 2016: 1-2 - [c6]Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet:
Towards high density 3D interconnections. 3DIC 2016: 1-5 - [c5]Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy:
ITAC: A complete 3D integration test platform. 3DIC 2016: 1-4 - 2015
- [c4]Pascal Vivet, Christian Bernard, Fabien Clermidy, Denis Dutoit, Eric Guthmuller, Ivan Miro Panades, Gaël Pillonnet, Yvain Thonnart, Arnaud Garnier, Didier Lattard, Amandine Jouve, Franck Bana, Thierry Mourier, Séverine Cheramy:
3D advanced integration technology for heterogeneous systems. 3DIC 2015: FS6.1-FS6.3 - [c3]Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo:
Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. 3DIC 2015: TS1.4.1-TS1.4.8 - 2013
- [c2]Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy:
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. 3DIC 2013: 1-7
2000 – 2009
- 2009
- [c1]Amadine Jouve, Wenbin Hong, D. Blumenshine, JoElle Dachsteiner, Rama Puligadda, Dongshun Bai, J. Diaz, David Henry:
Material improvement for ultrathin-wafer handling in TSV creation and PECVD process. 3DIC 2009: 1-5
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