"Die to Wafer Direct Hybid Bonding Demonstration with High Alignment ..."

Amadine Jouve et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058905

access: closed

type: Conference or Workshop Paper

metadata version: 2021-05-20

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Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger:
Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. 3DIC 2019: 1-7

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