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C. Ferrandon

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2010 – 2019

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2013
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Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy:
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. 3DIC 2013: 1-7
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Y. Lamy, Laurent Dussopt, Ossama El Bouayadi, C. Ferrandon, Alexandre Siligaris, Cedric Dehos, Pierre Vincent:
A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications. 3DIC 2013: 1-6

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