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J. Jourdon

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2020 – today

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2023
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Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne:
Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. IRPS 2023: 1-7

2010 – 2019

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2018
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Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux:
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS 2018: 4

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