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2010 – 2019
- 2014
[j6]Xuelian Liu, Mitchell R. LeRoy, Ryan Clarke, Michael Chu, H. O. Aquino
, Srikumar Raman, Aamir Zia, Russell P. Kraft, John F. McDonald:
Design of BiCMOS SRAMs for high-speed SiGe applications. IET Circuits Devices Syst. 8(6): 487-498 (2014)- 2012
- [c3]Xuelian Liu, Aamir Zia, Mitchell R. LeRoy, Srikumar Raman, Ryan Clarke, Russell P. Kraft, John F. McDonald:
A three-dimensional DRAM using floating body cell in FDSOI devices. DDECS 2012: 159-162 - 2011
- [j5]Jin Woo Kim, Michael Chu, Philip Jacob, Aamir Zia, Russell P. Kraft, John F. McDonald:
Reconfigurable 40 GHz BiCMOS uniform delay crossbar switch for broadband and wide tuning range narrowband applications. IET Circuits Devices Syst. 5(3): 159-169 (2011) - [j4]Aamir Zia, Sachhidh Kannan, H. Jonathan Chao, Garrett S. Rose:
3D NOC for many-core processors. Microelectron. J. 42(12): 1380-1390 (2011) - 2010
- [j3]Aamir Zia, Philip Jacob, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald:
A 3-D Cache With Ultra-Wide Data Bus for 3-D Processor-Memory Integration. IEEE Trans. Very Large Scale Integr. Syst. 18(6): 967-977 (2010)
2000 – 2009
- 2009
- [j2]Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald, Kerry Bernstein:
Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks. Proc. IEEE 97(1): 108-122 (2009) - [c2]John F. McDonald, Okan Erdogan, Philip Jacob, Paul M. Belemjian, Alexey Gutin, Aamir Zia, Michael Chu, Jin Woo Kim, Ryan Clarke, Nate DeSimone, Sherry Liu, Russell P. Kraft:
Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. 3DIC 2009: 1-7 - 2007
- [c1]Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Peng Jin, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald:
Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking. ICCD 2007: 202-207 - 2005
- [j1]Philip Jacob, Okan Erdogan, Aamir Zia, Paul M. Belemjian, Russell P. Kraft, John F. McDonald:
Predicting the Performance of a 3D Processor-Memory Chip Stack. IEEE Des. Test Comput. 22(6): 540-547 (2005)
Coauthor Index
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