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ORCIDPerrine Batude
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Journal Articles
- 2013
[j3]Shashikanth Bobba, Ashutosh Chakraborty, Olivier Thomas, Perrine Batude, Giovanni De Micheli:
Cell transformations and physical design techniques for 3D monolithic integrated circuits. ACM J. Emerg. Technol. Comput. Syst. 9(3): 19:1-19:28 (2013)- 2012
- [j2]Perrine Batude, Thomas Ernst
, Julien Arcamone, Gregory Arndt, Perceval Coudrain, Pierre-Emmanuel Gaillardon:
3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS. IEEE J. Emerg. Sel. Topics Circuits Syst. 2(4): 714-722 (2012) - 2009
- [j1]Gilles Poupon, Nicolas Sillon, David Henry, Charlotte Gillot, Alan Mathewson, Léa Di Cioccio, Barbara Charlet, Patrick Leduc, Maud Vinet, Perrine Batude:
System on Wafer: A New Silicon Concept in SiP. Proc. IEEE 97(1): 60-69 (2009)
Conference and Workshop Papers
- 2024
- [c25]Daphnée Bosch, Abygaël Viey, Tadeu Mota Frutuoso, P. Lheritier, C. Licitra, N. Zerhouni, A. Albouy, Laurent Brunet, A. Magalhaes-Lucas, L. M. B. da Silva, H. Boutry, M. Husien Fahmy Taha Abdelrahman, F. Cristiano, R. Gassilloud, M. Ribotta, G. Romano, William Vandendaele, V. Benevent, M. Opprecht, S. Kerdilès, F. Milesi, F. Mazen, Benoit Sklénard, C. Euvrard-Colnat, Johannes Sturm, A. Lambert, C. Candebage, L. Laraignou, F. Boulard, A. Sarrazin, M. De Souza, Christoforos G. Theodorou, Xavier Garros, Perrine Batude:
Breakthrough Processes for Si CMOS Devices with BEOL Compatibility for 3D Sequential Integrated more than Moore Analog Applications. VLSI Technology and Circuits 2024: 1-2 - [c24]J. Luge-Alvarez, J. B. David, Alexandre Siligaris, Vincent Puyal, G. Moritz, Tadeu Mota Frutuoso, V. Lapras, Claire Fenouillet-Béranger, Laurent Brunet, P. Vincent, Didier Lattard, Xavier Garros, François Andrieu, Perrine Batude:
First Radio-Frequency Circuits Fabricated in Top-Tier of a Full 3D Sequential Integration Process at mmW for 5G Applications. VLSI Technology and Circuits 2024: 1-2 - 2022
- [c23]Tadeu Mota Frutuoso, Xavier Garros, Perrine Batude, Laurent Brunet, Joris Lacord, Benoit Sklénard, V. Lapras, Claire Fenouillet-Béranger, M. Ribotta, A. Magalhaes-Lucas, J. Kanyandekwe, R. Kies, G. Romano, Edoardo Catapano, Mikaël Cassé, Jose Lugo-Alvarez, Philippe Ferrari, Fred Gaillard:
Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration. VLSI Technology and Circuits 2022: 332-333 - 2021
- [c22]Petros Sideris, Arnaud Peizerat, Perrine Batude, Christoforos G. Theodorou, Gilles Sicard:
Inter-tier Coupling Analysis in Back-illuminated Monolithic 3DSI Image Sensor Pixels. MOCAST 2021: 1-4 - 2020
- [c21]Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Romain Lemaire, Pascal Vivet, Perrine Batude, Didier Lattard:
M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC. DATE 2020: 1740-1745 - 2019
- [c20]Pascal Vivet, Gilles Sicard, Laurent Millet, Stéphane Chevobbe, Karim Ben Chehida, Luis Angel Cubero, Monte Alegre, Maxence Bouvier, Alexandre Valentian, Maria Lepecq, Thomas Dombek, Olivier Bichler, Sébastien Thuries, Didier Lattard, Séverine Cheramy, Perrine Batude, Fabien Clermidy:
Advanced 3D Technologies and Architectures for 3D Smart Image Sensors. DATE 2019: 674-679 - 2018
- [c19]Pascal Vivet, Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Didier Lattard, Edith Beigné, Perrine Batude:
Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges. ICECS 2018: 157-160 - [c18]François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, Didier Lattard, Sébastien Thuries, Olivier Billoint, Richard Fournel, Maud Vinet:
A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit. ICICDT 2018: 141-144 - 2017
- [c17]Jessy Micout, Quentin Rafhay, Xavier Garros, Mikaël Cassé, Jean Coignus, Luca Pasini, Cao-Minh Vincent Lu, Nils Rambal, Claire Fenouillet-Béranger, Laurent Brunet, G. Romano, R. Gassilloud, Perrine Batude, Maud Vinet, Gérard Ghibaudo:
Precise EOT regrowth extraction enabling performance analysis of low temperature extension first devices. ESSDERC 2017: 144-147 - [c16]Claire Fenouillet-Béranger, S. Beaurepaire, Fabien Deprat, Alexandre Ayres De Sousa, Laurent Brunet, Perrine Batude, Olivier Rozeau, François Andrieu, Paul Besombes, M.-P. Samson, Bernard Previtali, F. Nemouchi, G. Rodriguez, Philippe Rodriguez, R. Famulok, Nils Rambal, Viorel Balan, Z. Saghi, V. Jousseaume, Charles-Antoine Guérin, F. Ibars, F. Proud, D. Nouguier, David Ney, V. Delaye, H. Dansas, X. Federspiel, Maud Vinet:
Guidelines for intermediate back end of line (BEOL) for 3D sequential integration. ESSDERC 2017: 252-255 - [c15]Melanie Brocard, Benoît Mathieu, Jean-Philippe Colonna, Cristiano Santos, Claire Fenouillet-Béranger, Cao-Minh Vincent Lu, Gerald Cibrario, Laurent Brunet, Perrine Batude, François Andrieu, Sébastien Thuries, Olivier Billoint:
Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells. ISVLSI 2017: 539-544 - 2016
- [c14]Séverine Cheramy, Amandine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet:
Towards high density 3D interconnections. 3DIC 2016: 1-2 - [c13]Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet:
Towards high density 3D interconnections. 3DIC 2016: 1-5 - [c12]Melanie Brocard, Guillaume Berhault, Sébastien Thuries, Fabien Clermidy, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, François Andrieu, Fabien Deprat, Joris Lacord, Olivier Rozeau, Gerald Cibrario, Olivier Billoint:
Impact of intermediate BEOL technology on standard cell performances of 3D VLSI. ESSDERC 2016: 218-221 - [c11]Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Guillaume Berhault, Cristiano Lopes Dos Santos, Gerald Cibrario, Fabien Clermidy, Daniel Gitlin, Olivier Faynot:
Opportunities brought by sequential 3D CoolCube™ integration. ESSDERC 2016: 226-229 - [c10]Claire Fenouillet-Béranger, Perrine Batude, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, M.-P. Samson, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Gerald Cibrario, Maud Vinet:
Recent advances in 3D VLSI integration. ICICDT 2016: 1-4 - 2015
- [c9]Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Deprat, Alexandre Ayres De Sousa, Perrine Batude, Claire Fenouillet-Béranger, Fabien Clermidy:
Intermediate BEOL process influence on power and performance for 3DVLSI. 3DIC 2015: TS1.3.1-TS1.3.5 - [c8]Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, A. Fustier, Julien Michallet, Olivier Faynot, Ogun Turkyilmaz, Jean-Frédéric Christmann, Sébastien Thuries, Fabien Clermidy:
A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool. DATE 2015: 1192-1196 - [c7]Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, Ogun Turkyilmaz, Sébastien Thuries, Fabien Clermidy:
From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges. ISPD 2015: 127 - 2014
- [c6]Ogun Turkyilmaz, Gerald Cibrario, Olivier Rozeau, Perrine Batude, Fabien Clermidy:
3D FPGA using high-density interconnect Monolithic Integration. DATE 2014: 1-4 - [c5]Claire Fenouillet-Béranger, Bernard Previtali, Perrine Batude, Fabrice Nemouchi, Mikaël Cassé, Xavier Garros, Lucie Tosti, Nils Rambal, Dominique Lafond, Hugo Dansas, Luca Pasini, Laurent Brunet, Fabien Deprat, Magali Grégoire, M. Mellier, Maud Vinet:
FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration. ESSDERC 2014: 110-113 - 2012
- [c4]Joris Lacord, Perrine Batude, Gérard Ghibaudo, Frédéric Boeuf:
Analytical modeling of parasitics in monolithically integrated 3D inverters. ICICDT 2012: 1-4 - 2011
- [c3]Shashikanth Bobba, Ashutosh Chakraborty, Olivier Thomas, Perrine Batude, Thomas Ernst, Olivier Faynot, David Z. Pan, Giovanni De Micheli:
CELONCEL: Effective design technique for 3-D monolithic integration targeting high performance integrated circuits. ASP-DAC 2011: 336-343 - [c2]Perrine Batude, Maud Vinet, Arnaud Pouydebasque, Cyrille Le Royer, Bernard Previtali, Claude Tabone, Jean-Michel Hartmann, Loic Sanchez, Laurence Baud, Veronique Carron, Alain Toffoli, Fabienne Allain, Vincent Mazzocchi, Dominique Lafond, Simon Deleonibus, Olivier Faynot:
3D monolithic integration. ISCAS 2011: 2233-2236 - 2010
- [c1]Shashikanth Bobba, Ashutosh Chakraborty, Olivier Thomas, Perrine Batude, Vasilis F. Pavlidis, Giovanni De Micheli:
Performance analysis of 3-D monolithic integrated circuits. 3DIC 2010: 1-4
Coauthor Index
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