"First Radio-Frequency Circuits Fabricated in Top-Tier of a Full 3D ..."

J. Luge-Alvarez et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631483

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-18

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J. Luge-Alvarez, J. B. David, Alexandre Siligaris, Vincent Puyal, G. Moritz, Tadeu Mota Frutuoso, V. Lapras, Claire Fenouillet-Béranger, Laurent Brunet, P. Vincent, Didier Lattard, Xavier Garros, François Andrieu, Perrine Batude:
First Radio-Frequency Circuits Fabricated in Top-Tier of a Full 3D Sequential Integration Process at mmW for 5G Applications. VLSI Technology and Circuits 2024: 1-2

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