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2020 – today
- 2024
[c5]Ciro Scognamillo, Antonio Pio Catalano, Lorenzo Codecasa, Alberto Castellazzi, Vincenzo d'Alessandro:
Enhancing Electrical Ruggedness in Double-Sided Cooled Power Modules. PRIME 2024: 1-4- 2023
- [c4]Ciro Scognamillo, Antonio Pio Catalano
, Vincenzo d'Alessandro, Peter J. Zampardi, Kerry Burger:
Improving Performance of InGaP/GaAs HBT Arrays by means of Temperature-Dependent Base Ballasting Resistors. PRIME 2023: 9-12 - 2022
- [j15]Mahmoud Dhimish, Vincenzo d'Alessandro, Santolo Daliento:
Investigating the Impact of Cracks on Solar Cells Performance: Analysis Based on Nonuniform and Uniform Crack Distributions. IEEE Trans. Ind. Informatics 18(3): 1684-1693 (2022) - [c3]Ciro Scognamillo, Antonio Pio Catalano, Vincenzo d'Alessandro, Lorenzo Codecasa, Alberto Castellazzi:
Defect Detection in Double-Sided Cooled Power Modules by Structure Functions. PRIME 2022: 17-20
2010 – 2019
- 2018
- [j14]Lorenzo Codecasa, Robin Bornoff, James Dyson, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi:
Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources. Microelectron. Reliab. 87: 194-205 (2018) - [j13]Brice Rogié, Lorenzo Codecasa, Eric Monier-Vinard, Valentin Bissuel, Najib Laraqi, Olivier Daniel, Dario D'Amore, Alessandro Magnani, Vincenzo d'Alessandro, Niccolò Rinaldi:
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization. Microelectron. Reliab. 87: 222-231 (2018) - 2017
- [j12]Vincenzo d'Alessandro, Antonio Pio Catalano, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Brian Moser, Peter J. Zampardi:
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies. Microelectron. Reliab. 78: 233-242 (2017) - [j11]Lorenzo Codecasa, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi, Andre G. Metzger, Robin Bornoff, John Parry:
Partition-based approach to parametric dynamic compact thermal modeling. Microelectron. Reliab. 79: 361-370 (2017) - [j10]Lorenzo Codecasa, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi:
3-D thermal models calibration by parametric dynamic compact thermal models. Microelectron. Reliab. 79: 371-379 (2017) - [j9]Pascal Chevalier, Michael Schröter, Colombo R. Bolognesi, Vincenzo d'Alessandro, Maria Alexandrova, Josef Böck, Ralf Flickiger, Sébastien Fregonese, Bernd Heinemann, Christoph Jungemann, Rickard Lovblom, Cristell Maneux, Olivier Ostinelli, Andreas Pawlak, Niccolò Rinaldi, Holger Rücker, Gerald Wedel, Thomas Zimmer:
Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications. Proc. IEEE 105(6): 1035-1050 (2017) - [c2]Antonio Pio Catalano, Michele Riccio, Lorenzo Codecasa, Alessandro Magnani, Gianpaolo Romano, Vincenzo d'Alessandro, Luca Maresca, Nils Rinaldi, Giovanni Breglio, Andrea Irace:
Model-Order Reduction Procedure for Fast Dynamic Electrothermal Simulation of Power Converters. ApplePies 2017: 81-87 - 2016
- [j8]Vincenzo d'Alessandro, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Klaus Aufinger:
Advanced thermal simulation of SiGe: C HBTs including back-end-of-line. Microelectron. Reliab. 67: 38-45 (2016) - 2015
- [j7]Lorenzo Codecasa, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi:
Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction. Microelectron. J. 46(12): 1129-1137 (2015) - [j6]Thomas Jacquet, Grazia Sasso, Anjan Chakravorty, Niccolò Rinaldi, Klaus Aufinger, Thomas Zimmer, Vincenzo d'Alessandro, Cristell Maneux:
Reliability of high-speed SiGe: C HBT under electrical stress close to the SOA limit. Microelectron. Reliab. 55(9-10): 1433-1437 (2015) - 2014
- [j5]Michele Riccio, Vincenzo d'Alessandro, Andrea Irace, Gilles Rostaing, Mounira Berkani, Stéphane Lefebvre, Philippe Dupuy:
3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditions. Microelectron. Reliab. 54(9-10): 1845-1850 (2014) - 2013
- [j4]Andre G. Metzger, Vincenzo d'Alessandro, Niccolò Rinaldi, Peter J. Zampardi:
Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers. Microelectron. Reliab. 53(9-11): 1471-1475 (2013) - [j3]Vincenzo d'Alessandro, Alessandro Magnani, Michele Riccio, Yohei Iwahashi, Giovanni Breglio, Niccolò Rinaldi, Andrea Irace:
Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations. Microelectron. Reliab. 53(9-11): 1713-1718 (2013) - [c1]Alessandro Magnani, Vincenzo d'Alessandro, Niccolò Rinaldi, Massimiliano de Magistris, Klaus Aufinger:
Dynamic electrothermal macromodeling techniques for thermal-aware design of circuits and systems. PATMOS 2013: 227-230 - 2012
- [j2]Ana Villamor-Baliarda, Piet Vanmeerbeek, Michele Riccio, Vincenzo d'Alessandro, Andrea Irace, Jaume Roig, David Flores, Peter Moens:
Influence of charge balance on the robustness of trench-based super junction diodes. Microelectron. Reliab. 52(9-10): 2409-2413 (2012)
2000 – 2009
- 2004
- [j1]Nebojsa Nenadovic, Slobodan Mijalkovic, Lis K. Nanver, Lode K. J. Vandamme, Vincenzo d'Alessandro, Hugo Schellevis, Jan W. Slotboom:
Extraction and modeling of self-heating and mutual thermal coupling impedance of bipolar transistors. IEEE J. Solid State Circuits 39(10): 1764-1772 (2004) - 2002
- [b1]Vincenzo d'Alessandro:
Analysis of electro-thermal effects in semiconductor devices. University of Naples Federico II, Italy, 2002
Coauthor Index
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