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ORCIDMarcel A. J. van Gils
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Journal Articles
- 2008
[j9]S. Bendida, J. J. Koning, J. J. M. Bontemps, J. T. M. van Beek, D. Wu, Marcel A. J. van Gils, S. Nath:
Temperature stability of a piezoresistive MEMS resonator including self-heating. Microelectron. Reliab. 48(8-9): 1227-1231 (2008)- 2007
- [j8]Marcel A. J. van Gils, Olaf van der Sluis
, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. 47(2-3): 179-186 (2007) - [j7]W. D. van Driel, A. Mavinkurve, Marcel A. J. van Gils, G. Q. Zhang:
Advanced structural similarity rules for the BGA package family. Microelectron. Reliab. 47(2-3): 205-214 (2007) - [j6]Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages. Microelectron. Reliab. 47(2-3): 273-279 (2007) - [j5]Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, Marcel A. J. van Gils:
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. Microelectron. Reliab. 47(12): 1975-1982 (2007) - 2005
- [j4]W. D. van Driel, Marcel A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang:
Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectron. Reliab. 45(9-11): 1633-1638 (2005) - 2004
- [j3]Marcel A. J. van Gils, P. J. J. H. A. Habets, G. Q. Zhang, Willem D. van Driel, Piet J. G. Schreurs:
Characterization and Modelling of Moisture Driven Interface Failures. Microelectron. Reliab. 44(9-11): 1317-1322 (2004) - [j2]Y. T. He, Marcel A. J. van Gils, Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, Leo J. Ernst:
Prediction of crack growth in IC passivation layers. Microelectron. Reliab. 44(12): 2003-2009 (2004) - [j1]Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, Marcel A. J. van Gils, Leo J. Ernst:
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectron. Reliab. 44(12): 2019-2027 (2004)
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