- Michael D. Ries, Donald R. Banks, David P. Watson, Karl G. Hoebener:
Attachment of Solder Ball Connect (SBC) packages to circuit cards. IBM J. Res. Dev. 37(5): 597-608 (1993) - Alejandro G. Schrott, Gerald S. Frankel:
Application of X-ray spectroscopy to the study of electrochemically formed surface oxide films. IBM J. Res. Dev. 37(2): 191-206 (1993) - David Seeger:
Resist materials and processes for X-ray lithography. IBM J. Res. Dev. 37(3): 435-448 (1993) - Hajime Seki:
In situ infrared spectroscopy of the electrode - electrolyte interface. IBM J. Res. Dev. 37(2): 227-242 (1993) - Jerome P. Silverman, Robert P. Rippstein, James M. Oberschmidt:
X-ray lithography beamlines in the IBM Advanced Lithography Facility. IBM J. Res. Dev. 37(3): 395-410 (1993) - Henry I. Smith, Mark L. Schattenburg:
X-ray lithography from 500 to 30 nm: X-ray nanolithography. IBM J. Res. Dev. 37(3): 319-330 (1993) - Eberhard Spiller:
Early history of X-ray lithography at IBM. IBM J. Res. Dev. 37(3): 291-298 (1993) - Beth Tibbitts:
Flexible simulation of a complex semiconductor manufacturing line using a rule-based system. IBM J. Res. Dev. 37(4): 507-522 (1993) - John M. Warlaumont:
Preface. IBM J. Res. Dev. 37(3): 288-290 (1993) - James R. White:
Conduction mechanisms in contaminant layers on printed circuit boards. IBM J. Res. Dev. 37(2): 243-248 (1993) - Alan D. Wilson:
X-ray lithography in IBM, 1980-1992, the development years. IBM J. Res. Dev. 37(3): 299-318 (1993) - Martin N. Wilson, Ailstair I. C. Smith, V. C. Kempson, Martin C. Townsend, Joseph C. Schouten, Robert J. Anderson, A. R. Jorden, Victor P. Suller, Michael W. Poole:
The Helios 1 compact superconducting storage ring X-ray source. IBM J. Res. Dev. 37(3): 351-372 (1993) - Tien Y. Wu, Yifan Guo, William T. Chen:
Thermal-mechanical strain characterization for printed wiring boards. IBM J. Res. Dev. 37(5): 621-634 (1993)
