- Takashi Nomura, Mitsuhiro Hasegawa, Ko Oyama, Yosuke Kondo, Koji Ichikawa:
Evaluation of Ground Terminal against Noise by Direct Power Injection Method. EMC Compo 2024: 24-28 - Hyun Ho Park, Jiseong Kim, Eakhwan Song, Hongseok Kim, Sangho Cho:
Influence of Sensing Resistor on IC-level Noise Measurement of DC-DC Converters by 1 Ω Method. EMC Compo 2024: 33-36 - Francesco de Paulis, Faye Squires, Yifan Ding, Matteo Cocchini, Matthew Doyle, Samuel Connor, Albert E. Ruehli, Chulsoon Hwang, Lijun Jiang:
Suppression of Power Distribution Network PCB-Package Resonance for Low Target Impedance. EMC Compo 2024: 1-3 - Marco Pfeifer, Ko Odreitz, Bernd Deutschmann:
Evaluation of the Electromagnetic Emission of ICs Using Different Spread Spectrum Approaches. EMC Compo 2024: 106-110 - A. Rosa, Anna Richelli, Luigi Colalongo:
EMI Immunity of the Nauta Inverter-Based Amplifier. EMC Compo 2024: 15-18 - Jeremy Ruau, Bertrand Vrignon, Christophe Menard, Lucy Liu, Matthieu Baudry:
Near field scan investigation method to reduce 4.8 GHz emission on a BLE application. EMC Compo 2024: 37-41 - Andree Scambor, Christoph Maier:
Investigations on Microstrip and Ground Plane Partial Inductance in Finite-Width Structures. EMC Compo 2024: 1-5 - Alexander Schade, Frank Klotz, Robert Weigel:
Automated Method to Synthesize RLCK-Circuits from S-Parameters. EMC Compo 2024: 1-8 - Alexander Schade, Frank Klotz, Robert Weigel:
Loop Inductance Based RLCK Models of PCBs and IC-Packages in Practice. EMC Compo 2024: 1-8 - Matthias Schulz, Michael Kopf:
Passive DC-input and DC-input/AC-output EMI filter for DC-AC inverter. EMC Compo 2024: 1-6 - Norbert Seliger, Nico Leirich:
Reconfigurable Board-to-Board Interconnect Utilizing Bistable Compliant Ribbon Wires. EMC Compo 2024: 1-5 - Kazuki Shimada, Mototsugu Okushima:
On-Chip ESD Current Sensor for Nanosecond Oscillation Waveform Over Ampere Detecting. EMC Compo 2024: 46-50 - Hidetake Sugo, Norimasa Oka, Takaya Nagai, Koji Hattori, Takeshi Matsuzaki:
An ICIM-CI Model for Mass Production Development Considering Manufacturing Variations. EMC Compo 2024: 60-63 - Maurizio Tranchero, Marco Garelli:
Measurement of PCB-Related Commutation-Loop Inductance Using a Vector Network Analyzer. EMC Compo 2024: 1-4 - Hiraku Uehara, Koh Watanabe, Sosuke Ashida, Yushi Mitsuya, Satoshi Tanaka, Makoto Nagata:
Accuracy of GPS Positioning Measurements in response to Electromagnetic Noise Characteristics. EMC Compo 2024: 116-118 - Arunkumar H. Venkateshaiah, John F. Dawson, Martin A. Trefzer, Simon J. Bale, Andrew C. Marvin, Martin P. Robinson:
Design and Application of RFIC Detector: To Measure Coupled Power into IC Pin via PCB Trace. EMC Compo 2024: 42-45 - Takuya Wadatsumi, Rikuu Hasegawa, Kazuki Monta, Takuji Miki, Lang Lin, Norman Chang, Makoto Nagata:
Modeling and Analysis of On-Chip Voltage Fluctuations Caused by Electromagnetic Fault Injection. EMC Compo 2024: 1-4 - Jianfei Wu, Yanfang Lu, Yang Li, Hongli Zhang, Yiming Zhang, Xing Zhao, Wei Zhu:
STT-MRAM Based ESD and EFT Immunity Analysis. EMC Compo 2024: 96-99 - Shih-Yi Yuan, Shin-Hsien Chiang, Yun-Ling Wang, Liang-Yang Lin, Yuan-Fu Ku:
Clock Signal Recovery Algorithm for FPGA-based Microcontroller Near-Field EMI Measurement and Processing. EMC Compo 2024: 1-5 - Dominik Zupan, Nikolaus Czepl, Bernd Deutschmann:
Characterisation of an EMI-Improved Integrated Folded Cascode Amplifier Structure Using the EMIRR Measurement Method. EMC Compo 2024: 1-4 - 14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2024, Torino, Italy, October 7-9, 2024. IEEE 2024, ISBN 979-8-3315-0463-2 [contents]
