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Journal Articles
- 2024
[j7]Donghyeon Han
, Junha Ryu, Sangyeob Kim, Sangjin Kim, Jongjun Park, Hoi-Jun Yoo:
MetaVRain: A Mobile Neural 3-D Rendering Processor With Bundle-Frame-Familiarity-Based NeRF Acceleration and Hybrid DNN Computing. IEEE J. Solid State Circuits 59(1): 65-78 (2024)- [j6]Donghyeon Han, Junha Ryu, Sangyeob Kim, Sangjin Kim, Jongjun Park, Hoi-Jun Yoo:
A Low-Power Artificial-Intelligence-Based 3-D Rendering Processor With Hybrid Deep Neural Network Computing. IEEE Micro 44(1): 17-27 (2024) - [j5]Sanghyuk An, Junha Ryu, Gwangtae Park, Hoi-Jun Yoo:
A 8.81 TFLOPS/W Deep-Reinforcement-Learning Accelerator With Delta-Based Weight Sharing and Block-Mantissa Reconfigurable PE Array. IEEE Trans. Circuits Syst. II Express Briefs 71(5): 2529-2533 (2024) - 2023
- [j4]Dongseok Im, Gwangtae Park, Junha Ryu, Zhiyong Li, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
DSPU: An Efficient Deep Learning-Based Dense RGB-D Data Acquisition With Sensor Fusion and 3-D Perception SoC. IEEE J. Solid State Circuits 58(1): 177-188 (2023) - [j3]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
A Mobile 3-D Object Recognition Processor With Deep-Learning-Based Monocular Depth Estimation. IEEE Micro 43(3): 74-82 (2023) - 2021
- [j2]Sanghoon Kang, Donghyeon Han, Juhyoung Lee, Dongseok Im, Sangyeob Kim, Soyeon Kim, Junha Ryu, Hoi-Jun Yoo:
GANPU: An Energy-Efficient Multi-DNN Training Processor for GANs With Speculative Dual-Sparsity Exploitation. IEEE J. Solid State Circuits 56(9): 2845-2857 (2021) - [j1]Junha Ryu, Gwangtae Park, Dongseok Im, Ji-Hoon Kim, Hoi-Jun Yoo:
A 0.82 μW CIS-Based Action Recognition SoC With Self-Adjustable Frame Resolution for Always-on IoT Devices. IEEE Trans. Circuits Syst. II Express Briefs 68(5): 1700-1704 (2021)
Conference and Workshop Papers
- 2024
- [c13]Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Minsung Kim, Hoi-Jun Yoo:
A Low-Power Neural Graphics System for Instant 3D Modeling and Real-Time Rendering on Mobile AR/VR Devices. COOL CHIPS 2024: 1-3 - [c12]Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Minsung Kim, Hoi-Jun Yoo:
NeuGPU: A Neural Graphics Processing Unit for Instant Modeling and Real-Time Rendering on Mobile AR/VR Devices. HCS 2024: 1 - [c11]Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Hoi-Jun Yoo:
20.7 NeuGPU: A 18.5mJ/Iter Neural-Graphics Processing Unit for Instant-Modeling and Real-Time Rendering with Segmented-Hashing Architecture. ISSCC 2024: 372-374 - [c10]Seryeong Kim, Seokchan Song, Wonhoon Park, Junha Ryu, Sangyeob Kim, Gwangtae Park, Soyeon Kim, Hoi-Jun Yoo:
NeRF-Navi: A 93.6-202.9µJ/task Switchable Approximate-Accurate NeRF Path Planning Processor with Dual Attention Engine and Outlier Bit-Offloading Core. VLSI Technology and Circuits 2024: 1-2 - 2023
- [c9]Jongjun Park, Donghyeon Han, Junha Ryu, Dongseok Im, Gwangtae Park, Hoi-Jun Yoo:
A 33.6 FPS Embedding based Real-time Neural Rendering Accelerator with Switchable Computation Skipping Architecture on Edge Device. A-SSCC 2023: 1-3 - [c8]Donghyeon Han, Junha Ryu, Sangyeob Kim, Sangjin Kim, Jongjun Park, Hoi-Jun Yoo:
A Low-power Neural 3D Rendering Processor with Bio-inspired Visual Perception Core and Hybrid DNN Acceleration. COOL CHIPS 2023: 1-3 - [c7]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Hoi-Jun Yoo:
Sibia: Signed Bit-slice Architecture for Dense DNN Acceleration with Slice-level Sparsity Exploitation. HPCA 2023: 69-80 - [c6]Hankyul Kwon, Gwangtae Park, Junha Ryu, Wooyoung Jo, Hoi-Jun Yoo:
A 15.9 mW 96.5 fps Memory-Efficient 3D Reconstruction Processor with Dilation-based TSDF Fusion and Block-Projection Cache System. ISCAS 2023: 1-5 - [c5]Wonhoon Park, Junha Ryu, Sangjin Kim, Soyeon Um, Wooyoung Jo, Sangyoeb Kim, Hoi-Jun Yoo:
A 5.99 TFLOPS/W Heterogeneous CIM-NPU Architecture for an Energy Efficient Floating-Point DNN Acceleration. ISCAS 2023: 1-4 - [c4]Donghyeon Han, Junha Ryu, Sangyeob Kim, Sangjin Kim, Hoi-Jun Yoo:
MetaVRain: A 133mW Real-Time Hyper-Realistic 3D-NeRF Processor with 1D-2D Hybrid-Neural Engines for Metaverse on Mobile Devices. ISSCC 2023: 50-51 - 2022
- [c3]Dongseok Im, Gwangtae Park, Junha Ryu, Zhiyong Li, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
A Low-power and Real-time 3D Object Recognition Processor with Dense RGB-D Data Acquisition in Mobile Platforms. COOL CHIPS 2022: 1-3 - [c2]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
DSPU: A 281.6mW Real-Time Deep Learning-Based Dense RGB-D Data Acquisition with Sensor Fusion and 3D Perception System-on-Chip. HCS 2022: 1-25 - [c1]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Hoi-Jun Yoo:
DSPU: A 281.6mW Real-Time Depth Signal Processing Unit for Deep Learning-Based Dense RGB-D Data Acquisition with Depth Fusion and 3D Bounding Box Extraction in Mobile Platforms. ISSCC 2022: 510-512
Informal and Other Publications
- 2022
- [i2]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Hoi-Jun Yoo:
Energy-efficient Dense DNN Acceleration with Signed Bit-slice Architecture. CoRR abs/2203.07679 (2022) - 2020
- [i1]Donghyeon Han, Gwangtae Park, Junha Ryu, Hoi-Jun Yoo:
Extension of Direct Feedback Alignment to Convolutional and Recurrent Neural Network for Bio-plausible Deep Learning. CoRR abs/2006.12830 (2020)
Coauthor Index
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