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Hankyul Kwon
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2020 – today
- 2024
- [c6]Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Minsung Kim, Hoi-Jun Yoo:
A Low-Power Neural Graphics System for Instant 3D Modeling and Real-Time Rendering on Mobile AR/VR Devices. COOL CHIPS 2024: 1-3 - [c5]Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Minsung Kim, Hoi-Jun Yoo:
NeuGPU: A Neural Graphics Processing Unit for Instant Modeling and Real-Time Rendering on Mobile AR/VR Devices. HCS 2024: 1 - [c4]Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Hoi-Jun Yoo:
20.7 NeuGPU: A 18.5mJ/Iter Neural-Graphics Processing Unit for Instant-Modeling and Real-Time Rendering with Segmented-Hashing Architecture. ISSCC 2024: 372-374 - 2023
- [j2]Dongseok Im, Gwangtae Park, Junha Ryu, Zhiyong Li, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
DSPU: An Efficient Deep Learning-Based Dense RGB-D Data Acquisition With Sensor Fusion and 3-D Perception SoC. IEEE J. Solid State Circuits 58(1): 177-188 (2023) - [j1]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
A Mobile 3-D Object Recognition Processor With Deep-Learning-Based Monocular Depth Estimation. IEEE Micro 43(3): 74-82 (2023) - [c3]Hankyul Kwon, Gwangtae Park, Junha Ryu, Wooyoung Jo, Hoi-Jun Yoo:
A 15.9 mW 96.5 fps Memory-Efficient 3D Reconstruction Processor with Dilation-based TSDF Fusion and Block-Projection Cache System. ISCAS 2023: 1-5 - 2022
- [c2]Dongseok Im, Gwangtae Park, Junha Ryu, Zhiyong Li, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
A Low-power and Real-time 3D Object Recognition Processor with Dense RGB-D Data Acquisition in Mobile Platforms. COOL CHIPS 2022: 1-3 - [c1]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
DSPU: A 281.6mW Real-Time Deep Learning-Based Dense RGB-D Data Acquisition with Sensor Fusion and 3D Perception System-on-Chip. HCS 2022: 1-25
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