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ORCIDFang Yang 0006
Person information
- affiliation: Peking University, Institute of Microelectronics, Beijing, China
Other persons with the same name
- Fang Yang — disambiguation page
- Fang Yang 0001
![[0000-0003-3575-5086]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0003-3575-5086")
— Tsinghua University, Beijing National Research Center for Information Science and Technology, Beijing, China (and 1 more) - Fang Yang 0002 — Xi'an University of Science and Technology, School of Electrical and Control Engineering, Xi'an, China
- Fang Yang 0003 — Kunming University of Science and Technology, Faculty of Transportation Engineering, Kunming, China (and 1 more)
- Fang Yang 0004 — Hebei University, School of Cyber Security and Computer, Baoding, China
- Fang Yang 0005 — Wuhan University of Science and Technology, Engineering Research Center of Metallurgical Automation and Measurement Technology, Wuhan, China
- Fang Yang 0007 — University of Iowa, Iowa City, IA, USA
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2010 – 2019
- 2018
[c8]Taotao Guan, Fang Yang, Wei Wang, Peng Liu, Zexin Fan, Leijian Cheng, Zikun Chen, Runze Yu, Qiancheng Zhao, Wei Wang, Dacheng Zhang:
A High-Selectivity HNA Etching System for Bulk Micromachined Deep Holes with High Roundness. NEMS 2018: 397-400- 2015
- [c7]Lingqian Zhang, Yaoping Liu, Fang Yang, Wei Wang, Dacheng Zhang, Zhihong Li:
Parylene C autofluorescence for on-chip highest processing temperature sensing. NEMS 2015: 302-305 - [c6]Taotao Guan, Fang Yang, Wei Wang, Xian Huang, Jun He, Li Zhang, Fengshan Fu, Rui Li, Dacheng Zhang:
Investigation of stress rupture properties of micro beams using the piezoresistive effect. NEMS 2015: 537-540 - [c5]Fengshan Fu, Fang Yang, Wei Wang, Xian Huang, Jun He, Li Zhang, Taotao Guan, Rui Li, Dacheng Zhang:
Discussion and analysis of Au/a-Si contact resistance in MEMS/NEMS devices. NEMS 2015: 593-596 - 2014
- [c4]Danqi Zhao, Xian Huang, Jun He, Li Zhang, Peng Liu, Fang Yang, Dacheng Zhang:
Study on compatible CMOS-MEMS process with surface micromachining for the application of monolithic integration. NEMS 2014: 513-516 - [c3]Xian Huang, Jun He, Li Zhang, Fang Yang, Dacheng Zhang:
Evaluation of Au/a-Si eutectic wafer level bonding process. NEMS 2014: 560-563 - [c2]Jun He, Xian Huang, Li Zhang, Danqi Zhao, Fang Yang, Wei Wang, Dacheng Zhang:
Mechanical strength measurement of micro anchor-beam combined structure fabricated by silicon-on-glass process. NEMS 2014: 568-571 - 2013
- [c1]Xian Huang, Fang Yang, Danqi Zhao, Jun He, Xuejiao Fan, Wei Wang, Dacheng Zhang:
Effect of phosphorus doping on the performance of Au/Si inter-diffusion. NEMS 2013: 542-545
Coauthor Index
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