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ORCIDKripesh Vaidyanathan
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Journal Articles
- 2010
[j5]Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang
, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn:
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. Microelectron. Reliab. 50(7): 986-994 (2010)- 2009
- [j4]Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen:
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. Microelectron. Reliab. 49(2): 150-162 (2009) - 2008
- [j3]Xiaowu Zhang, Kripesh Vaidyanathan, Tai Chong Chai, Teck Chun Tan, D. Pinjala:
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). Microelectron. Reliab. 48(4): 602-610 (2008) - 2006
- [j2]M. Y. Pan, Manoj Gupta, Andrew A. O. Tay, Kripesh Vaidyanathan:
Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging. Microelectron. Reliab. 46(5-6): 763-767 (2006) - 2002
- [j1]Mohandass Sivakumar, Kripesh Vaidyanathan, Chong Ser Choong, Tai Chong Chai, Loon Aik Lim:
Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly. Microelectron. Reliab. 42(9-11): 1535-1540 (2002)
Coauthor Index
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