"Reliability of Wire Bonding on Low-k Dielectric Material in Damascene ..."

Mohandass Sivakumar et al. (2002)

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DOI: 10.1016/S0026-2714(02)00185-3

access: closed

type: Journal Article

metadata version: 2020-02-22

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Mohandass Sivakumar, Kripesh Vaidyanathan, Chong Ser Choong, Tai Chong Chai, Loon Aik Lim:
Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly. Microelectron. Reliab. 42(9-11): 1535-1540 (2002)

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