"Underfill selection methodology for fine pitch Cu/low-k FCBGA packages."

Xuefen Ong et al. (2009)

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DOI: 10.1016/J.MICROREL.2008.11.015

access: closed

type: Journal Article

metadata version: 2021-10-14

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Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen:
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. Microelectron. Reliab. 49(2): 150-162 (2009)

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