"Board level solder joint reliability analysis of a fine pitch Cu post type ..."

Xiaowu Zhang et al. (2008)

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DOI: 10.1016/J.MICROREL.2007.05.009

access: closed

type: Journal Article

metadata version: 2020-10-26

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Xiaowu Zhang, Kripesh Vaidyanathan, Tai Chong Chai, Teck Chun Tan, D. Pinjala:
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). Microelectron. Reliab. 48(4): 602-610 (2008)

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