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Tadahiro Shibutani
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2020 – today
- 2021
- [j13]Masahito Takezawa, Yuto Otoguro, Kohei Matsuo, Tadahiro Shibutani, Akio Sakurai, Takashi Maekawa:
Fabrication of doubly-curved CFRP shell structures with control over fiber directions. Comput. Aided Des. 136: 103028 (2021)
2010 – 2019
- 2018
- [j12]Junji Sakamoto, Ryoma Hirata, Tadahiro Shibutani:
Potential failure mode identification of operational amplifier circuit board by using high accelerated limit test. Microelectron. Reliab. 85: 19-24 (2018) - 2017
- [j11]Junji Sakamoto, Hisakazu Ohara, Tadahiro Shibutani:
Finite element analysis of thermal and mechanical stresses due to the grain anisotropy of polycrystalline β-Sn. Microelectron. Reliab. 71: 29-34 (2017) - [j10]Tadahiro Shibutani, Jing Wen Sun:
Nucleation and shrinkage of defects on the surface of tin induced by local strain distribution. Microelectron. Reliab. 79: 119-123 (2017) - 2016
- [j9]Daeil Kwon, Melinda R. Hodkiewicz, Jiajie Fan, Tadahiro Shibutani, Michael G. Pecht:
IoT-Based Prognostics and Systems Health Management for Industrial Applications. IEEE Access 4: 3659-3670 (2016) - [j8]Takuma Imai, Tadahiro Shibutani, Kazumi Matsui, Seitoku Kumagai, Dang Tien Tran, Kaiyuan Mu, Takashi Maekawa:
Curvature sensitive analysis of axially compressed cylindrical tubes with corrugated surface using isogeometric analysis and experiment. Comput. Aided Geom. Des. 49: 17-30 (2016) - [j7]Michael G. Pecht, Tadahiro Shibutani, Lifeng Wu:
A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded. Microelectron. Reliab. 62: 113-123 (2016) - [j6]Michael G. Pecht, Tadahiro Shibutani, Myeongsu Kang, Melinda Hodkiewicz, Edward Cripps:
A fusion prognostics-based qualification test methodology for microelectronic products. Microelectron. Reliab. 63: 320-324 (2016) - 2012
- [j5]Hiroki Yoshihara, Tatsuya Yoshii, Tadahiro Shibutani, Takashi Maekawa:
Topologically robust B-spline surface reconstruction from point clouds using level set methods and iterative geometric fitting algorithms. Comput. Aided Geom. Des. 29(7): 422-434 (2012) - [j4]Hyun-Seok Oh, Tadahiro Shibutani, Michael G. Pecht:
Precursor monitoring approach for reliability assessment of cooling fans. J. Intell. Manuf. 23(2): 173-178 (2012)
2000 – 2009
- 2008
- [j3]Qiang Yu, Tadahiro Shibutani, Do-Seop Kim, Yusuke Kobayashi, Jidong Yang, Masaki Shiratori:
Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints. Microelectron. Reliab. 48(3): 431-437 (2008) - [j2]Tadahiro Shibutani, Qiang Yu, Masaki Shiratori, Michael G. Pecht:
Pressure-induced tin whisker formation. Microelectron. Reliab. 48(7): 1033-1039 (2008) - [j1]Tadahiro Shibutani, Ji Wu, Qiang Yu, Michael G. Pecht:
Key reliability concerns with lead-free connectors. Microelectron. Reliab. 48(10): 1613-1627 (2008) - [c1]Tadahiro Shibutani, Qiang Yu, Masaki Shiratori:
Effect of Creep Properties on Pressure Induced Tin Whisker Formation. SSIRI 2008: 197-198
Coauthor Index
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