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Jindo Byun
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2020 – today
- 2022
- [c5]Joohwan Kim, Junyoung Park, Jindo Byun, Changkyu Seol, Chang Soo Yoon, EunSeok Shin, Hyunyoon Cho, Youngdo Um, Sucheol Lee, Hyungmin Jin, Kwangseob Shin, Hyunsub Norbert Rie, Minsu Jung, Jin-Hee Park, Go-Eun Cha, Minjae Lee, YoungMin Kim, Byeori Han, Yuseong Jeon, Jisun Lee, Hyejeong So, Sungduk Kim, Wansoo Park, Tae Young Kim, Youngdon Choi, Jung-Hwan Choi, Hyungjong Ko, Sang-Hyun Lee:
A 60-Gb/s/pin single-ended PAM-4 transmitter with timing skew training and low power data encoding in mimicked 10nm class DRAM process. CICC 2022: 1-2 - [c4]Hyunsub Norbert Rie, Chang Soo Yoon, Jindo Byun, Sucheol Lee, Garam Kim, Joohwan Kim, Junyoung Park, Hyunyoon Cho, Youngdo Um, Hyungmin Jin, Kwangseob Shin, Minsu Jung, Go-Eun Cha, Minjae Lee, YoungMin Kim, Byeori Han, Yuseong Jeon, Jisun Lee, EunSeok Shin, Hyuk-Jun Kwon, Youngdon Choi, Jung-Hwan Choi, Hyungjong Ko:
A 40-Gb/s/pin Low-Voltage POD Single-Ended PAM-4 Transceiver with Timing Calibrated Reset-less Slicer and Bidirectional T-Coil for GDDR7 Application. VLSI Technology and Circuits 2022: 148-149 - 2021
- [c3]Hyungmin Jin, Jindo Byun, Hyunyoon Cho, Hojun Yoon, Jin-Hee Park, Kyoungsoo Kim, Youngdon Choi, Jung-Hwan Choi, Hyungjong Ko, Sang-Hyun Lee:
A 24Gb/s/pin PAM-4 Built Out Tester chip enabling PAM-4 chips test with NRZ interface ATE. A-SSCC 2021: 1-3 - [c2]Hojun Yoon, Wonjoo Jung, Jaewoo Park, Jindo Byun, Hyungmin Jin, Hyunyoon Cho, Youngmin Kim, Baek-Jin Lim, Young-Chul Cho, Youngdon Choi, Jung-Hwan Choi, Hyungjong Ko, Changsik Yoo, Sang-Hyun Lee:
A 3.2-12.8Gb/s Duty-Cycle Compensating Quadrature Error Corrector for DRAM Interfaces, With Fast Locking and Low Power Characteristics. ESSCIRC 2021: 463-466
2010 – 2019
- 2019
- [c1]Dongku Kang, Minsu Kim, Suchang Jeon, Wontaeck Jung, Jooyong Park, Gyo Soo Choo, Dong-Kyo Shim, Anil Kavala, Seungbum Kim, Kyung-Min Kang, Jiyoung Lee, Kuihan Ko, Hyun Wook Park, ByungJun Min, Changyeon Yu, Sewon Yun, Nahyun Kim, Yeonwook Jung, Sungwhan Seo, Sunghoon Kim, Moo Kyung Lee, Joo-Yong Park, James C. Kim, Young San Cha, Kwangwon Kim, Youngmin Jo, Hyun-Jin Kim, Youngdon Choi, Jindo Byun, Ji-hyun Park, Kiwon Kim, Tae-Hong Kwon, Young-Sun Min, Chiweon Yoon, Youngcho Kim, Dong-Hun Kwak, Eungsuk Lee, Wook-Ghee Hahn, Ki-Sung Kim, Kyungmin Kim, Euisang Yoon, Wontae Kim, Inryul Lee, Seunghyun Moon, Jeong-Don Ihm, Dae-Seok Byeon, Ki-Whan Song, Sangjoon Hwang, Kyehyun Kyung:
A 512Gb 3-bit/Cell 3D 6th-Generation V-NAND Flash Memory with 82MB/s Write Throughput and 1.2Gb/s Interface. ISSCC 2019: 216-218 - 2011
- [j1]Dong-Yeop Kim, Jindo Byun, Sang-Hoon Lee, Se-Jang Oh, Ki-Sang Kang, Hai-Young Lee:
Signal Integrity Improvements of a MEMS Probe Card Using Back-Drilling and Equalizing Techniques. IEEE Trans. Instrum. Meas. 60(3): 872-879 (2011)
Coauthor Index
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