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ORCIDZhiyong Li 0016
Person information
- affiliation: Korea Advanced Institute of Science and Technology, KAIST, School of Electrical Engineering, Korea
Other persons with the same name
- Zhiyong Li (aka: Zhi-Yong Li) — disambiguation page
- Zhiyong Li 0001
![[0000-0001-9720-5915]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0001-9720-5915")
— Hunan University, National Supercomputing Center in Changsha, China - Zhiyong Li 0002 — SAS Institute, Cary, NC, USA (and 1 more)
- Zhiyong Li 0003 — Shandong University of Technology, School of Mechanical Engineering, Zibo, China
- Zhiyong Li 0004 — Wuhan University, Department of Prosthodontics, School and hospital of Stomatology, Wuhan, China
- Zhiyong Li 0005 — E-commerce Co. Ltd., Shenzhen, China
- Zhiyong Li 0006 — Zheijiang University, China
- Zhiyong Li 0007 — China University of Geosciences, Wuhan, China
- Zhiyong Li 0008 — Hunan Shenfan Technology Co., Ltd., Changsha, China (and 1 more)
- Zhiyong Li 0009 — Honghe University, China
- Zhiyong Li 0010 — Queensland University of Technology, Brisbane, Australia (and 1 more)
- Zhiyong Li 0011 — Southwestern University of Finance and Economics, Chengdu, China (and 1 more)
- Zhiyong Li 0012 — Tianjin University, College of Management and Economics, China
- Zhiyong Li 0013 — Chongqing University, School of Automation, China
- Zhiyong Li 0014 — Chinese Academy of Sciences, Institute of Semiconductors, Beijing, China
- Zhiyong Li 0015 — North China University of Water Resources and Electric Power, School of Management and Economics, Zhengzhou, China
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2020 – today
- 2025
[j7]Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Minsung Kim, Hoi-Jun Yoo:
NeuGPU: An Energy-Efficient Neural Graphics Processing Unit for Instant Modeling and Real-Time Rendering on Mobile Devices. IEEE J. Solid State Circuits 60(1): 99-111 (2025)- 2024
- [j6]Sangjin Kim, Zhiyong Li, Soyeon Um, Wooyoung Jo, Sangwoo Ha, Juhyoung Lee, Sangyeob Kim, Donghyeon Han, Hoi-Jun Yoo:
DynaPlasia: An eDRAM In-Memory Computing-Based Reconfigurable Spatial Accelerator With Triple-Mode Cell. IEEE J. Solid State Circuits 59(1): 102-115 (2024) - [j5]Sangjin Kim, Soyeon Um, Wooyoung Jo, Jingu Lee, Sangwoo Ha, Zhiyong Li, Hoi-Jun Yoo:
Scaling-CIM: eDRAM In-Memory-Computing Accelerator With Dynamic-Scaling ADC and Adaptive Analog Operation. IEEE J. Solid State Circuits 59(8): 2694-2705 (2024) - [j4]Beomseok Kwon, Zhiyong Li, Sangjin Kim, Wooyoung Jo, Hoi-Jun Yoo:
A 92 fps and 2.56 mJ/Frame Computing-In-Memory-Based Human Pose Estimation Accelerator With Resource-Efficient Macro for Mobile Devices. IEEE Trans. Circuits Syst. II Express Briefs 71(6): 2921-2925 (2024) - [c15]Sangjin Kim, Zhiyong Li, Soyeon Um, Wooyoung Jo, Sangwoo Ha, Sangyeob Kim, Hoi-Jun Yoo:
NoPIM: Functional Network-on-Chip Architecture for Scalable High-Density Processing-in-Memory-based Accelerator. COOL CHIPS 2024: 1-3 - [c14]Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Minsung Kim, Hoi-Jun Yoo:
A Low-Power Neural Graphics System for Instant 3D Modeling and Real-Time Rendering on Mobile AR/VR Devices. COOL CHIPS 2024: 1-3 - [c13]Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Minsung Kim, Hoi-Jun Yoo:
NeuGPU: A Neural Graphics Processing Unit for Instant Modeling and Real-Time Rendering on Mobile AR/VR Devices. HCS 2024: 1 - [c12]Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Hoi-Jun Yoo:
20.7 NeuGPU: A 18.5mJ/Iter Neural-Graphics Processing Unit for Instant-Modeling and Real-Time Rendering with Segmented-Hashing Architecture. ISSCC 2024: 372-374 - 2023
- [j3]Dongseok Im, Gwangtae Park, Junha Ryu, Zhiyong Li, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
DSPU: An Efficient Deep Learning-Based Dense RGB-D Data Acquisition With Sensor Fusion and 3-D Perception SoC. IEEE J. Solid State Circuits 58(1): 177-188 (2023) - [j2]Zhiyong Li, Sangjin Kim, Dongseok Im, Donghyeon Han, Hoi-Jun Yoo:
An Efficient Deep-Learning-Based Super-Resolution Accelerating SoC With Heterogeneous Accelerating and Hierarchical Cache. IEEE J. Solid State Circuits 58(3): 614-623 (2023) - [j1]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
A Mobile 3-D Object Recognition Processor With Deep-Learning-Based Monocular Depth Estimation. IEEE Micro 43(3): 74-82 (2023) - [c11]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Hoi-Jun Yoo:
Sibia: Signed Bit-slice Architecture for Dense DNN Acceleration with Slice-level Sparsity Exploitation. HPCA 2023: 69-80 - [c10]Seryeong Kim, Soyeon Kim, Soyeon Um, Sangjin Kim, Zhiyong Li, Sangyeob Kim, Wooyoung Jo, Hoi-Jun Yoo:
A Reconfigurable 1T1C eDRAM-based Spiking Neural Network Computing-In-Memory Processor for High System-Level Efficiency. ISCAS 2023: 1-5 - [c9]Sangjin Kim, Zhiyong Li, Soyeon Um, Wooyoung Jo, Sangwoo Ha, Juhyoung Lee, Sangyeob Kim, Donghyeon Han, Hoi-Jun Yoo:
DynaPlasia: An eDRAM In-Memory-Computing-Based Reconfigurable Spatial Accelerator with Triple-Mode Cell for Dynamic Resource Switching. ISSCC 2023: 256-257 - [c8]Sangjin Kim, Soyeon Um, Wooyoung Jo, Jingu Lee, Sangwoo Ha, Zhiyong Li, Hoi-Jun Yoo:
Scaling-CIM: An eDRAM-based In-Memory-Computing Accelerator with Dynamic-Scaling ADC for SQNR-Boosting and Layer-wise Adaptive Bit-Truncation. VLSI Technology and Circuits 2023: 1-2 - 2022
- [c7]Zhiyong Li, Sangjin Kim, Dongseok Im, Donghyeon Han, Hoi-Jun Yoo:
An 0.92 mJ/frame High-quality FHD Super-resolution Mobile Accelerator SoC with Hybrid-precision and Energy-efficient Cache. CICC 2022: 1-2 - [c6]Dongseok Im, Gwangtae Park, Junha Ryu, Zhiyong Li, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
A Low-power and Real-time 3D Object Recognition Processor with Dense RGB-D Data Acquisition in Mobile Platforms. COOL CHIPS 2022: 1-3 - [c5]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo:
DSPU: A 281.6mW Real-Time Deep Learning-Based Dense RGB-D Data Acquisition with Sensor Fusion and 3D Perception System-on-Chip. HCS 2022: 1-25 - [c4]Zhiyong Li, Sangjin Kim, Dongseok Im, Donghyeon Han, Hoi-Jun Yoo:
An Efficient High-quality FHD Super-resolution Mobile Accelerator SoC with Hybrid-precision and Energy-efficient Cache. HCS 2022: 1-26 - [c3]Wooyoung Jo, Sangjin Kim, Juhyeong Lee, Soyeon Um, Zhiyong Li, Hoi-Jun Yoo:
A 161.6 TOPS/W Mixed-mode Computing-in-Memory Processor for Energy-Efficient Mixed-Precision Deep Neural Networks. ISCAS 2022: 365-369 - [c2]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Hoi-Jun Yoo:
DSPU: A 281.6mW Real-Time Depth Signal Processing Unit for Deep Learning-Based Dense RGB-D Data Acquisition with Depth Fusion and 3D Bounding Box Extraction in Mobile Platforms. ISSCC 2022: 510-512 - [i1]Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Hoi-Jun Yoo:
Energy-efficient Dense DNN Acceleration with Signed Bit-slice Architecture. CoRR abs/2203.07679 (2022) - 2021
- [c1]Zhiyong Li, Dongseok Im, Jinsu Lee, Hoi-Jun Yoo:
A 3.6 TOPS/W Hybrid FP-FXP Deep Learning Processor with Outlier Compensation for Image-to-Image Application. ISCAS 2021: 1-5
Coauthor Index
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