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2020 – today
- 2023
[c7]Vince S. Siu
, Kuan Yu Hsieh, Italo Buleje, Takashi Itoh, Tian Hao, Ben Civjan, Nigel Hinds, Bing Dang, Jeffrey L. Rogers, Bo Wen:
Health Guardian: Using Multi-modal Data to Understand Individual Health. ICDH 2023: 65-74- [c6]Italo Buleje, Vince S. Siu, Kuan Yu Hsieh, Nigel Hinds, Bing Dang, Erhan Bilal, Thanhnha Nguyen, Ellen E. Lee, Colin A. Depp, Jeffrey L. Rogers:
A Versatile Data Fabric for Advanced IoT-Based Remote Health Monitoring. ICDH 2023: 88-90 - [i3]Italo Buleje, Vince S. Siu, Kuan Yu Hsieh, Nigel Hinds, Bing Dang, Erhan Bilal, Thanhnha Nguyen, Ellen E. Lee, Colin A. Depp, Jeffrey L. Rogers:
A Versatile Data Fabric for Advanced IoT-Based Remote Health Monitoring. CoRR abs/2310.01673 (2023) - [i2]Vince S. Siu, Kuan Yu Hsieh, Italo Buleje, Takashi Itoh, Tian Hao, Ben Civjan, Nigel Hinds, Bing Dang, Jeffrey L. Rogers, Bo Wen:
Health Guardian: Using Multi-modal Data to Understand Individual Health. CoRR abs/2310.01733 (2023) - 2022
- [c5]Bo Wen, Vince S. Siu, Italo Buleje, Kuan Yu Hsieh, Takashi Itoh, Lukas Zimmerli, Nigel Hinds, Elif Eyigöz, Bing Dang, Stefan von Cavallar, Jeffrey L. Rogers:
Health Guardian Platform: A technology stack to accelerate discovery in Digital Health research. ICDH 2022: 40-46 - [i1]Bo Wen, Vince S. Siu, Italo Buleje, Kuan Yu Hsieh, Takashi Itoh, Lukas Zimmerli, Nigel Hinds, Elif Eyigöz, Bing Dang, Stefan von Cavallar, Jeffrey L. Rogers:
Health Guardian Platform: A technology stack to accelerate discovery in Digital Health research. CoRR abs/2211.06330 (2022) - 2021
- [c4]Bing Dang, John Dicarlo, Stanislav Lukashov, Nigel Hinds, Jenna Reinen, Bo Wen, Tian Hao, Erhan Bilal, Jeff Rogers:
Development of a Smart Sleep Mask with Multiple Sensors. EMBC 2021: 7058-7062 - 2020
- [j7]Yeyuan Huang, Ang Li, Pinhua Xie, Zhaokun Hu, Jin Xu, Xiaoyi Fang, Hongmei Ren, Xiaomei Li, Bing Dang:
NOx Emission Flux Measurements with Multiple Mobile-DOAS Instruments in Beijing. Remote. Sens. 12(16): 2527 (2020)
2010 – 2019
- 2015
- [c3]Kevin Tien, Noah Sturcken, Naigang Wang, Jae-Woong Nah, Bing Dang, Eugene J. O'Sullivan, Paul S. Andry, Michele Petracca, Luca P. Carloni, William J. Gallagher, Kenneth L. Shepard:
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors. VLSIC 2015: 192- - 2012
- [j6]Timothy O. Dickson, Yong Liu, Sergey V. Rylov, Bing Dang, Cornelia K. Tsang, Paul S. Andry, John F. Bulzacchelli, Herschel A. Ainspan, Xiaoxiong Gu, Lavanya Turlapati, Michael P. Beakes, Benjamin D. Parker, John U. Knickerbocker, Daniel J. Friedman:
An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects. IEEE J. Solid State Circuits 47(4): 884-896 (2012)
2000 – 2009
- 2008
- [j5]John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright:
Three-dimensional silicon integration. IBM J. Res. Dev. 52(6): 553-569 (2008) - [j4]Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, Edmund J. Sprogis, Steven L. Wright, Bing Dang, Dennis G. Manzer:
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. IBM J. Res. Dev. 52(6): 571-581 (2008) - [j3]Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker:
3D chip stacking with C4 technology. IBM J. Res. Dev. 52(6): 599-609 (2008) - [j2]Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker:
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM J. Res. Dev. 52(6): 611-622 (2008) - [c2]Muhannad S. Bakir, Calvin King, Deepak C. Sekar, Hiren D. Thacker, Bing Dang, Gang Huang, Azad Naeemi, James D. Meindl:
3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation. CICC 2008: 663-670 - 2007
- [c1]Muhannad S. Bakir, Bing Dang, James D. Meindl:
Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems. CICC 2007: 421-428 - 2005
- [j1]John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang:
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM J. Res. Dev. 49(4-5): 725-754 (2005)
Coauthor Index
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