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ORCIDMuhannad S. Bakir
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- affiliation: Georgia Institute of Technology, Atlanta GA, USA
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2020 – today
- 2024
[c27]Ankit Kaul, Madison Manley, James Read, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir:
Co-Optimization for Robust Power Delivery Design in 3D-Heterogeneous Integration of Compute In-Memory Accelerators. VLSI Technology and Circuits 2024: 1-2- 2023
- [j4]Wantong Li
, Madison Manley, James Read, Ankit Kaul, Muhannad S. Bakir, Shimeng Yu:
H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention. IEEE Trans. Very Large Scale Integr. Syst. 31(10): 1592-1602 (2023) - 2022
- [j3]Sreejith Kochupurackal Rajan, Bharath Ramakrishnan, Husam Alissa, Washington Kim, Christian Belady, Muhannad S. Bakir:
Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management. IEEE Access 10: 59259-59269 (2022) - [j2]Yandong Luo, Sourav Dutta, Ankit Kaul, Sung Kyu Lim, Muhannad S. Bakir, Suman Datta, Shimeng Yu:
A Compute-in-Memory Hardware Accelerator Design With Back-End-of-Line (BEOL) Transistor Based Reconfigurable Interconnect. IEEE J. Emerg. Sel. Topics Circuits Syst. 12(2): 445-457 (2022) - [c26]Jiaao Lu, Muneeb Zia, Matthew J. Williams, Amanda L. Jacob, Bryce Chung, Samuel J. Sober, Muhannad S. Bakir:
High-performance Flexible Microelectrode Array with PEDOT: PSS Coated 3D Micro-cones for Electromyographic Recording. EMBC 2022: 5111-5114 - 2021
- [c25]Ankit Kaul, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir:
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance. 3DIC 2021: 1-5 - [c24]Sreejith Kochupurackal Rajan, Ankit Kaul, Gary S. May, Muhannad S. Bakir:
Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs. 3DIC 2021: 1-5 - 2020
- [c23]Rakshith Saligram, Ankit Kaul, Muhannad S. Bakir, Arijit Raychowdhury:
Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication. VLSI-SoC (Selected Papers) 2020: 149-178 - [c22]Rakshith Saligram, Ankit Kaul, Muhannad S. Bakir, Arijit Raychowdhury:
A Model Study of Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication in 2.5D Integration. VLSI-SOC 2020: 159-164 - [i1]Md Obaidul Hossen, Yang Zhang, Hesam Fathi Moghadam, Yue Zhang, Michael Dayringer, Muhannad S. Bakir:
Design Space Exploration of Power Delivery For Advanced Packaging Technologies. CoRR abs/2008.03124 (2020)
2010 – 2019
- 2019
- [c21]Sreejith Kochupurackal Rajan, Ming Jui Li, Muhannad S. Bakir, Gary S. May:
High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating. 3DIC 2019: 1-4 - 2018
- [c20]Pyungwoo Yeon, Muhannad S. Bakir, Maysam Ghovanloo:
Towards a 1.1 mm2 free-floating wireless implantable neural recording SoC. CICC 2018: 1-4 - 2017
- [c19]Pyungwoo Yeon, Joe L. Gonzalez, Muneeb Zia, Sreejith Kochupurackal Rajan, Gary S. May, Muhannad S. Bakir, Maysam Ghovanloo:
Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes. BioCAS 2017: 1-4 - [c18]Muhannad S. Bakir:
PhD forum: Heterogeneous interconnection of ICs using stitch-chips. VLSI-SoC 2017: 1-4 - 2016
- [j1]Muneeb Zia, Chaoqi Zhang, Hyun Suk Yang, Li Zheng, Muhannad S. Bakir:
Chip-to-chip interconnect integration technologies. IEICE Electron. Express 13(6): 20162001 (2016) - [c17]William Wahby, Thomas E. Sarvey, Hardik Sharma, Hadi Esmaeilzadeh, Muhannad S. Bakir:
The impact of 3D stacking on GPU-accelerated deep neural networks: An experimental study. 3DIC 2016: 1-4 - [c16]Yang Zhang, Xuchen Zhang, William Wahby, Muhannad S. Bakir:
Design considerations for 2.5-D and 3-D integration accounting for thermal constraints. 3DIC 2016: 1-5 - 2015
- [c15]Hanju Oh, Gary S. May, Muhannad S. Bakir:
Silicon interposer platform with low-loss through-silicon vias using air. 3DIC 2015: TS11.3.1-TS11.3.4 - [c14]Muneeb Zia, Chaoqi Zhang, Paragkumar Thadesar, Tracy Hookway, Taiyun Chi, Joe L. Gonzalez, Todd C. McDevitt, Hua Wang, Muhannad S. Bakir:
Fabrication of and cell growth on 'silicon membranes' with high density TSVs for bio-sensing applications. BioCAS 2015: 1-4 - [c13]Thomas E. Sarvey, Yang Zhang, Li Zheng, Paragkumar Thadesar, Ravi Gutala, Colman Cheung, Arifur Rahman, Muhannad S. Bakir:
Embedded cooling technologies for densely integrated electronic systems. CICC 2015: 1-8 - 2014
- [c12]Yang Zhang, Thomas E. Sarvey, Muhannad S. Bakir:
Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation. 3DIC 2014: 1-5 - [c11]Chaoqi Zhang, Paragkumar Thadesar, Muneeb Zia, Thomas E. Sarvey, Muhannad S. Bakir:
Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects. 3DIC 2014: 1-4 - 2013
- [c10]William Wahby, Ashish Dembla, Muhannad S. Bakir:
Evaluation of 3DICs and fabrication of monolithic interlayer vias. 3DIC 2013: 1-6 - [c9]Yue Zhang, Hanju Oh, Muhannad S. Bakir:
Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs. 3DIC 2013: 1-6 - 2012
- [c8]Li Zheng, Muhannad S. Bakir:
Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer. SoCC 2012: 159-164 - 2010
- [c7]James D. Meindl, Azad Naeemi, Muhannad S. Bakir, R. Murali:
Nanoelectronics in retrospect, prospect and principle. ISSCC 2010: 31-35
2000 – 2009
- 2009
- [c6]Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad S. Bakir, Yogendra K. Joshi, Andrei G. Fedorov, Sung Kyu Lim:
Co-design of signal, power, and thermal distribution networks for 3D ICs. DATE 2009: 610-615 - 2008
- [c5]Muhannad S. Bakir, Calvin King, Deepak C. Sekar, Hiren D. Thacker, Bing Dang, Gang Huang, Azad Naeemi, James D. Meindl:
3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation. CICC 2008: 663-670 - 2007
- [c4]Muhannad S. Bakir, Bing Dang, James D. Meindl:
Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems. CICC 2007: 421-428 - 2006
- [c3]Azad Naeemi, Muhannad S. Bakir:
Chip-level and Input/Output Interconnects for Gigascale SOCs: Limits and Opportunities. SoCC 2006: 323-324 - 2004
- [c2]Kaveh Shakeri, Muhannad S. Bakir, James D. Meindl:
Coaxial polymer pillars: ultra-low inductance compliant wafer-level electrical input/output interconnects for power distribution. SoCC 2004: 78-81 - 2002
- [c1]Muhannad S. Bakir, Hollie A. Reed, Anthony V. Mulé, Paul A. Kohl, Kevin P. Martin, James D. Meindl:
Sea of leads (SoL) characterization and design for compatibility with board-level optical waveguide interconnection. CICC 2002: 491-494
Coauthor Index
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