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ORCIDAkihiro Noriki
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2020 – today
- 2021
[c8]Takeru Amano, Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Takayuki Kurosu, Koichi Takemura, Tsuyoshi Aoki, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi:
Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate. OFC 2021: 1-3- 2020
- [c7]Akihiro Noriki
, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Koichi Takemura, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi, Takeru Amano:
Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors. ECOC 2020: 1-4
2010 – 2019
- 2019
- [c6]Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi, Takeru Amano:
Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror. 3DIC 2019: 1-4 - [c5]Koichi Takemura, Akio Ukita, Yasuhiro Ibusuki, Mitsuru Kurihara, Akihiro Noriki, Takeru Amano, Daisuke Okamoto, Yasuyuki Suzuki, Kazuhiko Kurata:
Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers. 3DIC 2019: 1-6 - 2011
- [c4]Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI. 3DIC 2011: 1-4 - 2010
- [c3]Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI. 3DIC 2010: 1-4
2000 – 2009
- 2009
- [c2]Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC 2009: 1-5 - [c1]Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. 3DIC 2009: 1-6
Coauthor Index
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