"Through Silicon photonic via (TSPV) with Si core for low loss and ..."

Akihiro Noriki et al. (2010)

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DOI: 10.1109/3DIC.2010.5751435

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI. 3DIC 2010: 1-4

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