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ORCIDDonghyun Han
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2020 – today
- 2024
[c10]Donghyun Han, Sunghoon Kim, Sungho Kang:
Signal Shifting-based Reusable Redundant TSV Structure for Infrastructure TSV. ISOCC 2024: 290-291- 2023
- [j7]Youngkwang Lee
, Donghyun Han, Sooryeong Lee, Sungho Kang:
Novel Error-Tolerant Voltage-Divider-Based Through-Silicon-Via Test Architecture. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(1): 308-321 (2023) - [j6]Youngkwang Lee, Donghyun Han, Sungho Kang:
TSV Built-In Self-Repair Architecture for Improving the Yield and Reliability of HBM. IEEE Trans. Very Large Scale Integr. Syst. 31(4): 578-590 (2023) - [c9]Sunghoon Kim, Donghyun Han, Seokjun Jang, Sungho Kang:
LOTS: Low Overhead TSV Repair Method Using IEEE-1838 Standard Architecture. ISOCC 2023: 289-290 - 2022
- [j5]Sangmin Park, Minho Cheong, Donghyun Han, Sungho Kang:
Herringbone-Based TSV Architecture for Clustered Fault Repair and Aging Recovery. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(4): 1142-1153 (2022) - [j4]Hogyeong Kim, Hayoung Lee, Donghyun Han, Sungho Kang:
Multibank Optimized Redundancy Analysis Using Efficient Fault Collection. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(8): 2739-2752 (2022) - 2021
- [j3]Donghyun Han, Hayoung Lee, Sungho Kang:
Effective Spare Line Allocation Built-in Redundancy Analysis With Base Common Spare for Yield Improvement of 3D Memory. IEEE Access 9: 76716-76729 (2021) - [j2]Donghyun Han, Hayoung Lee, Seungtaek Lee, Sungho Kang:
ECC-Aware Fast and Reliable Pattern Matching Redundancy Analysis for Highly Reliable Memory. IEEE Access 9: 133274-133288 (2021) - [c8]Youngkwang Lee, Donghyun Han, Sooryeong Lee, Sungho Kang:
A Circular-based TSV Repair Architecture. ISOCC 2021: 1-2 - [c7]Donghyun Han, Youngkwang Lee, Sooryeong Lee, Sungho Kang:
Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC. ISOCC 2021: 101-102 - [c6]Youngki Moon, Hyunho Yoo, Donghyun Han, Sungho Kang:
Area Efficient Built-In Redundancy Analysis using Pre-Solutions with Various Spare Structure. ISOCC 2021: 431-432 - 2020
- [c5]Hayoung Lee, Donghyun Han, Hogyeong Kim, Sungho Kang:
Redundancy Analysis Optimization with Clustered Known Solutions for High Speed Repair. ISOCC 2020: 51-52 - [c4]Hayoung Lee, Donghyun Han, Hogyeong Kim, Sungho Kang:
W-ERA: One-Time Memory Repair with Wafer-Level Early Repair Analysis for Cost Reduction. ITC-Asia 2020: 94-99
2010 – 2019
- 2019
- [j1]Hayoung Lee, Donghyun Han, Seungtaek Lee, Sungho Kang:
Dynamic Built-In Redundancy Analysis for Memory Repair. IEEE Trans. Very Large Scale Integr. Syst. 27(10): 2365-2374 (2019) - [c3]Hayoung Lee, Donghyun Han, Seungtaek Lee, Sungho Kang:
Redundancy Analysis based on Fault Distribution for Memory with Complex Spares. ISOCC 2019: 235-236 - 2018
- [c2]Donghyun Han, Hayoung Lee, Seungtaek Lee, Minho Moon, Sungho Kang:
3D Memory Formed of Unrepairable Memory Dice and Spare Layer. TENCON 2018: 1362-1366 - 2017
- [c1]Donghyun Han, Hayoung Lee, Donghyun Kim, Sungho Kang:
A new repair scheme for TSV-based 3D memory using base die repair cells. ISOCC 2017: 11-12
Coauthor Index
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