"A new repair scheme for TSV-based 3D memory using base die repair cells."

Donghyun Han et al. (2017)

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DOI: 10.1109/ISOCC.2017.8368804

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-27

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Donghyun Han, Hayoung Lee, Donghyun Kim, Sungho Kang:
A new repair scheme for TSV-based 3D memory using base die repair cells. ISOCC 2017: 11-12

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