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E. Brum
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2020 – today
- 2021
- [j3]Letícia Maria Veiras Bolzani, Moritz Fieback, Susanne Hoffmann-Eifert, Thiago Copetti, E. Brum, Stephan Menzel, Said Hamdioui, Tobias Gemmeke:
Review of Manufacturing Process Defects and Their Effects on Memristive Devices. J. Electron. Test. 37(4): 427-437 (2021) - [c3]E. Brum, Moritz Fieback, Thiago Santos Copetti, H. Jiayi, Said Hamdioui, Fabian Vargas, Letícia Maria Veiras Bolzani:
Evaluating the Impact of Process Variation on RRAMs. LATS 2021: 1-6 - 2020
- [j2]Thiago Copetti, Tiago R. Balen, E. Brum, C. Aquistapace, Leticia Bolzani Poehls:
Comparing the Impact of Power Supply Voltage on CMOS- and FinFET-Based SRAMs in the Presence of Resistive Defects. J. Electron. Test. 36(2): 271-284 (2020)
2010 – 2019
- 2019
- [j1]G. Cardoso Medeiros, E. Brum, Leticia Bolzani Poehls, Thiago Copetti, Tiago R. Balen:
Evaluating the Impact of Temperature on Dynamic Fault Behaviour of FinFET-Based SRAMs with Resistive Defects. J. Electron. Test. 35(2): 191-200 (2019) - [c2]Thiago Santos Copetti, Tiago R. Balen, E. Brum, C. Aquistapace, Leticia Bolzani Poehls:
A Comparative Study Between FinFET and CMOS-Based SRAMs under Resistive Defects. LATS 2019: 1-6 - 2018
- [c1]G. Cardoso Medeiros, E. Brum, Leticia Bolzani Poehls, Thiago Copetti, Tiago R. Balen:
Influence of temperature on dynamic fault behavior due to resistive defects in FinFET-based SRAMs. LATS 2018: 1-6
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